Evolution of microstructure and residual stress for a lead-frame Cu-2.13Fe-0.026 P (wt%) alloy
- Award ID(s):
- 2226508
- PAR ID:
- 10475565
- Publisher / Repository:
- ELSEVIER SCIENCE SAPO BOX 564, 1001 LAUSANNE, SWITZERLAND
- Date Published:
- Journal Name:
- Journal of Alloys and Compounds
- Volume:
- 965
- Issue:
- C
- ISSN:
- 0925-8388
- Page Range / eLocation ID:
- 171383
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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