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Title: Evolution of microstructure and residual stress for a lead-frame Cu-2.13Fe-0.026 P (wt%) alloy
Award ID(s):
2226508
NSF-PAR ID:
10475565
Author(s) / Creator(s):
; ; ; ; ;
Publisher / Repository:
ELSEVIER SCIENCE SAPO BOX 564, 1001 LAUSANNE, SWITZERLAND
Date Published:
Journal Name:
Journal of Alloys and Compounds
Volume:
965
Issue:
C
ISSN:
0925-8388
Page Range / eLocation ID:
171383
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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