Wirth, William, Comeaux, Jacob, and Jang, Seonhee. Characterization of flexible low-dielectric constant carbon-doped oxide (SiCOH) thin films under repeated mechanical bending stress. Retrieved from https://par.nsf.gov/biblio/10478313. Journal of Materials Science 57.46 Web. doi:10.1007/s10853-022-07987-y.

Wirth, William, Comeaux, Jacob, & Jang, Seonhee. Characterization of flexible low-dielectric constant carbon-doped oxide (SiCOH) thin films under repeated mechanical bending stress. Journal of Materials Science, 57 (46). Retrieved from https://par.nsf.gov/biblio/10478313. https://doi.org/10.1007/s10853-022-07987-y

Wirth, William, Comeaux, Jacob, and Jang, Seonhee. "Characterization of flexible low-dielectric constant carbon-doped oxide (SiCOH) thin films under repeated mechanical bending stress". Journal of Materials Science 57 (46). Country unknown/Code not available: Springer. https://doi.org/10.1007/s10853-022-07987-y. https://par.nsf.gov/biblio/10478313.

@article{osti_10478313,
place = {Country unknown/Code not available}, title = {Characterization of flexible low-dielectric constant carbon-doped oxide (SiCOH) thin films under repeated mechanical bending stress}, url = {https://par.nsf.gov/biblio/10478313}, DOI = {10.1007/s10853-022-07987-y}, abstractNote = {}, journal = {Journal of Materials Science}, volume = {57}, number = {46}, publisher = {Springer}, author = {Wirth, William and Comeaux, Jacob and Jang, Seonhee}, }