Ahammed, Kamal, Tsui, Lok-Kun, Carroll, Shianne, Lavin, Judi, and Huang, Qiang. Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers. Retrieved from https://par.nsf.gov/biblio/10483520. IEEE Transactions on Applied Superconductivity 33.8 Web. doi:10.1109/TASC.2023.3311320.

Ahammed, Kamal, Tsui, Lok-Kun, Carroll, Shianne, Lavin, Judi, & Huang, Qiang. Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers. IEEE Transactions on Applied Superconductivity, 33 (8). Retrieved from https://par.nsf.gov/biblio/10483520. https://doi.org/10.1109/TASC.2023.3311320

Ahammed, Kamal, Tsui, Lok-Kun, Carroll, Shianne, Lavin, Judi, and Huang, Qiang. "Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers". IEEE Transactions on Applied Superconductivity 33 (8). Country unknown/Code not available: IEEE. https://doi.org/10.1109/TASC.2023.3311320. https://par.nsf.gov/biblio/10483520.

@article{osti_10483520,
place = {Country unknown/Code not available}, title = {Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers}, url = {https://par.nsf.gov/biblio/10483520}, DOI = {10.1109/TASC.2023.3311320}, abstractNote = {}, journal = {IEEE Transactions on Applied Superconductivity}, volume = {33}, number = {8}, publisher = {IEEE}, author = {Ahammed, Kamal and Tsui, Lok-Kun and Carroll, Shianne and Lavin, Judi and Huang, Qiang}, }