Thomas, Elayne M., McBride, Matthew K., Lee, Owen A., Hayward, Ryan C., and Crosby, Alfred J. Predicting the Electrical, Mechanical, and Geometric Contributions to Soft Electroadhesives through Fracture Mechanics. Retrieved from https://par.nsf.gov/biblio/10487864. ACS Applied Materials & Interfaces 15.25 Web. doi:10.1021/acsami.3c03392.

Thomas, Elayne M., McBride, Matthew K., Lee, Owen A., Hayward, Ryan C., & Crosby, Alfred J. Predicting the Electrical, Mechanical, and Geometric Contributions to Soft Electroadhesives through Fracture Mechanics. ACS Applied Materials & Interfaces, 15 (25). Retrieved from https://par.nsf.gov/biblio/10487864. https://doi.org/10.1021/acsami.3c03392

Thomas, Elayne M., McBride, Matthew K., Lee, Owen A., Hayward, Ryan C., and Crosby, Alfred J. "Predicting the Electrical, Mechanical, and Geometric Contributions to Soft Electroadhesives through Fracture Mechanics". ACS Applied Materials & Interfaces 15 (25). Country unknown/Code not available: American Chemical Society. https://doi.org/10.1021/acsami.3c03392. https://par.nsf.gov/biblio/10487864.

@article{osti_10487864,
place = {Country unknown/Code not available}, title = {Predicting the Electrical, Mechanical, and Geometric Contributions to Soft Electroadhesives through Fracture Mechanics}, url = {https://par.nsf.gov/biblio/10487864}, DOI = {10.1021/acsami.3c03392}, abstractNote = {}, journal = {ACS Applied Materials & Interfaces}, volume = {15}, number = {25}, publisher = {American Chemical Society}, author = {Thomas, Elayne M. and McBride, Matthew K. and Lee, Owen A. and Hayward, Ryan C. and Crosby, Alfred J.}, }