Anderson, Cameron, Fan, Z. Hugh, Richstein, Jorg, Sussman, Mark, and Nishida, Toshikazu. A Comparison of Relative Seebeck Coefficients for Screen Printed Flexible Thermocouples Using Commercially Available Conductive Inks. Retrieved from https://par.nsf.gov/biblio/10495174. 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) . Web. doi:10.1109/FLEPS57599.2023.10220389.

Anderson, Cameron, Fan, Z. Hugh, Richstein, Jorg, Sussman, Mark, & Nishida, Toshikazu. A Comparison of Relative Seebeck Coefficients for Screen Printed Flexible Thermocouples Using Commercially Available Conductive Inks. 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), (). Retrieved from https://par.nsf.gov/biblio/10495174. https://doi.org/10.1109/FLEPS57599.2023.10220389

Anderson, Cameron, Fan, Z. Hugh, Richstein, Jorg, Sussman, Mark, and Nishida, Toshikazu. "A Comparison of Relative Seebeck Coefficients for Screen Printed Flexible Thermocouples Using Commercially Available Conductive Inks". 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) (). Country unknown/Code not available: IEEE. https://doi.org/10.1109/FLEPS57599.2023.10220389. https://par.nsf.gov/biblio/10495174.

@article{osti_10495174,
place = {Country unknown/Code not available}, title = {A Comparison of Relative Seebeck Coefficients for Screen Printed Flexible Thermocouples Using Commercially Available Conductive Inks}, url = {https://par.nsf.gov/biblio/10495174}, DOI = {10.1109/FLEPS57599.2023.10220389}, abstractNote = {}, journal = {2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)}, publisher = {IEEE}, author = {Anderson, Cameron and Fan, Z. Hugh and Richstein, Jorg and Sussman, Mark and Nishida, Toshikazu}, }