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Area‐selective atomic layer deposition (AS‐ALD) techniques are an emerging class of bottom‐up nanofabrication techniques that selectively deposit patterned ALD films without the need for conventional top‐down lithography. To achieve this patterning, most reported AS‐ALD techniques use a chemical inhibitor layer to proactively block ALD surface reactions in selected areas. Herein, an AS‐ALD process is demonstrated that uses a focused electron beam (e‐beam) to dissociate ambient water vapor and “write” highly resolved hydroxylated patterns on the surface of highly oriented pyrolytic graphite (HOPG). The patterned hydroxylated regions then support subsequent ALD deposition. The e‐beam functionalization technique facilitates precise pattern placement through control of beam position, dwell time, and current. Spatial resolution of the technique exceeded 42 nm, with a surface selectivity of between 69.9% and 99.7%, depending on selection of background nucleation regions. This work provides a fabrication route for AS‐ALD on graphitic substrates suitable for fabrication of graphene‐based nanoelectronics.
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Intrinsic and atomic layer etching enhanced area-selective atomic layer deposition of molybdenum disulfide thin films
For continual scaling in microelectronics, new processes for precise high volume fabrication are required. Area-selective atomic layer deposition (ASALD) can provide an avenue for self-aligned material patterning and offers an approach to correct edge placement errors commonly found in top-down patterning processes. Two-dimensional transition metal dichalcogenides also offer great potential in scaled microelectronic devices due to their high mobilities and few-atom thickness. In this work, we report ASALD of MoS2 thin films by deposition with MoF6 and H2S precursor reactants. The inherent selectivity of the MoS2 atomic layer deposition (ALD) process is demonstrated by growth on common dielectric materials in contrast to thermal oxide/ nitride substrates. The selective deposition produced few layer MoS2 films on patterned growth regions as measured by Raman spectroscopy and time-of-flight secondary ion mass spectrometry. We additionally demonstrate that the selectivity can be enhanced by implementing atomic layer etching (ALE) steps at regular intervals during MoS2 growth. This area-selective ALD process provides an approach for integrating 2D films into next-generation devices by leveraging the inherent differences in surface chemistries and providing insight into the effectiveness of a supercycle ALD and ALE process.
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- PAR ID:
- 10496133
- Publisher / Repository:
- AIP Publishing
- Date Published:
- Journal Name:
- Journal of Vacuum Science & Technology A
- Volume:
- 41
- Issue:
- 5
- ISSN:
- 0734-2101
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1116/6.0002811
