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Title: Rapid 3D Printing of Nanoporous Copper Powders via Micro-Clip
Abstract

Three-dimensional (3D) printing of metal components through powder bed fusion, material extrusion, and vat photopolymerization, has attracted interest continuously. Particularly, extrusion-based and photopolymerization-based processes employ metal particle-reinforced polymer matrix composites (PMCs) as raw materials. However, the resolution for extrusion-based printing is limited by the speed-accuracy tradeoff. In contrast, photopolymerization-based processes can significantly improve the printing resolution, but the filler loading of the PMC is typically low due to the critical requirement on raw materials’ rheological properties. Herein, we develop a new metal 3D printing strategy by utilizing micro-continuous liquid interface printing (μCLIP) to print PMC resins comprising nanoporous copper (NP-Cu) powders. By balancing the need for higher filler loading and the requirements on rheological properties to enable printability for the μCLIP, the compositions of PMC resin were optimized. In detail, the concentration of the NP-Cu powders in the resins can reach up to 40 wt% without sacrificing the printability and printing speed (10 μm·s−1). After sintering, 3D copper structures with microscale features (470 ± 140 μm in diameter) manifesting an average resistivity of 150 kΩ·mm can be realized. In summary, this new strategy potentially benefits the rapid prototyping of metal components with higher resolution at faster speeds.

 
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Award ID(s):
1932899
NSF-PAR ID:
10501197
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
American Society of Mechanical Engineers
Date Published:
Journal Name:
ASME 2023 18th International Manufacturing Science and Engineering Conference
ISBN:
978-0-7918-8723-3
Format(s):
Medium: X
Location:
New Brunswick, New Jersey, USA
Sponsoring Org:
National Science Foundation
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