Abstract Interfacial thermal resistance plays a crucial role in efficient heat dissipation in modern electronic devices. It is critical to understand the interfacial thermal transport from both experiments and underlying physics. This review is focused on the transient opto-thermal Raman-based techniques for measuring the interfacial thermal resistance between 2D materials and substrate. This transient idea eliminates the use of laser absorption and absolute temperature rise data, therefore provides some of the highest level measurement accuracy and physics understanding. Physical concepts and perspectives are given for the time-domain differential Raman (TD-Raman), frequency-resolved Raman (FR-Raman), energy transport state-resolved Raman (ET-Raman), frequency domain ET-Raman (FET-Raman), as well as laser flash Raman and dual-wavelength laser flash Raman techniques. The thermal nonequilibrium between optical and acoustic phonons, as well as hot carrier diffusion must be considered for extremely small domain characterization of interfacial thermal resistance. To have a better understanding of phonon transport across material interfaces, we introduce a new concept termed effective interface energy transmission velocity. It is very striking that many reported interfaces have an almost constant energy transmission velocity over a wide temperature range. This physics consideration is inspired by the thermal reffusivity theory, which is effective for analyzing structure-phonon scattering. We expect the effective interface energy transmission velocity to give an intrinsic picture of the transmission of energy carriers, unaltered by the influence of their capacity to carry heat.
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Thermal resistance across Si–SiGe alloy interface from phonon distribution mismatch
Interfacial thermal resistance has often been attributed to the mismatch of phonon spectra between two materials and resulting phonon-interface scattering. However, we use the solution of Peierls–Boltzmann transport equation to reveal a substantial nonequilibrium thermal resistance across the interfaces of Si and SiGe alloys at room temperature, despite their nearly identical phonon dispersion and negligible phonon-interface scattering. The Kapitza length of the Si–Si0.99Ge0.01 interface is approximately 600 nm of Si. This originates from the mismatch in phonon distribution between Si and SiGe alloys due to their distinct scattering rates. The mismatch is relaxed by phonon scattering over a region of 1 μm around the interface, corresponding to the upper bound of mean free path Λx of heat-carrying phonons. The relaxation process leads to the significant entropy generation and increased thermal resistance. Introducing a gradual variation in Ge concentration near the interface markedly reduces thermal resistance when implemented over the 1 μm period. Our finding demonstrates that the interfacial thermal resistance can be significant due to the nonequilibrium phonon distribution, even in the absence of phonon-interface scattering. In addition, among various phonon modes with a wide range of Λx, the relaxation of the nonequilibrium is predominantly governed by the phonons with long Λx.
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- Award ID(s):
- 1943807
- PAR ID:
- 10510050
- Publisher / Repository:
- American Institute of Physics
- Date Published:
- Journal Name:
- Applied Physics Letters
- Volume:
- 124
- Issue:
- 14
- ISSN:
- 0003-6951
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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