Abstract Thermal management in electric vehicles, electronics, and robotics requires the systematic ability to dissipate and direct the flow of heat. Thermally conductive soft composites are promising for thermal management due to their high thermal conductivity and mechanical flexibility. However, composites typically have the same microstructure throughout a film, which limits directional and spatial control of thermal management in emerging systems that have distributed heat loads. Herein, directional and spatially tunable thermal properties are programmed into liquid metal (LM) soft composites through a direct ink writing (DIW) process. Through the local control of LM droplet aspect ratio and orientation this programmable LM microstructure has a thermal conductivity in the direction of LM elongation of 9.9 W m−1·K−1, which is ∼40 times higher than the unfilled elastomer (0.24 W m−1·K−1). The DIW process enables LM droplets to be oriented in specific directions with tunable aspect ratios at different locations throughout a continuous film. This introduces anisotropic and heterogeneous thermal conductivity in compliant films to control the direction and magnitude of heat transfer. This methodology and resulting materials can provide designed thermal management solutions for rigid and soft devices.
more »
« less
Thermo‐Mechanically Stable, Liquid Metal Embedded Soft Materials for High‐Temperature Applications
Abstract Liquid‐metal embedded elastomers (LMEEs) have been demonstrated to show a variety of excellent properties, including high toughness, dielectric constant, and thermal conductivity, with applications across soft electronics and robotics. However, within this scope of use cases, operation in extreme environments – such as high‐temperature conditions – may lead to material degradation. While prior works highlight the functionality of LMEEs, there is limited insight on the thermal stability of these soft materials and how the effects of liquid metal (LM) inclusions depend on temperature. Here, the effects on thermal stability, including mechanical and electrical properties, of LMEEs are introduced. Effects are characterized for both fluoroelastomer and other elastomer‐based composites at temperature exposures up to 325 °C, where it is shown that embedding LM can offer improvements in thermo‐mechanical stability. Compared to elastomer like silicone rubber that has been previously used for LMEEs, a fluoroelastomer matrix offers a higher dielectric constant and significant improvement in thermo‐mechanical stability without sacrificing room temperature properties, such as thermal conductivity and modulus. Fluoroelastomer‐LM composites offer a promising soft, multi‐functional material for high‐temperature applications, which is demonstrated here with a printed, soft heat sink and an endoscopic sensor capable of wireless sensing of high temperatures.
more »
« less
- PAR ID:
- 10519863
- Publisher / Repository:
- Wiley VCH GmbH
- Date Published:
- Journal Name:
- Advanced Functional Materials
- ISSN:
- 1616-301X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Liquid metal (LM) elastomer composites offer promising potential in soft robotics, wearable electronics, and human‐machine interfaces. Direct ink write (DIW) 3D printing offers a versatile manufacturing technique capable of precise control over LM microstructures, yet challenges such as interfilament void formation in multilayer structures impact material performance. Here, a DIW strategy is introduced to control both LM microstructure and material architecture. Investigating three key process parameters–nozzle height, extrusion rate, and nondimensionalized nozzle velocity–it is found that nozzle height and velocity predominantly influence filament geometry. The nozzle height primarily dictates the aspect ratio of the filament and the formation of voids. A threshold print height based on filament geometry is identified; below the height, significant surface roughness occurs, and above the ink fractures, which facilitates the creation of porous structures with tunable stiffness and programmable LM microstructure. These porous architectures exhibit reduced density and enhanced thermal conductivity compared to cast samples. When used as a dielectric in a soft capacitive sensor, they display high sensitivity (gauge factor = 9.0), as permittivity increases with compressive strain. These results demonstrate the capability to simultaneously manipulate LM microstructure and geometric architecture in LM elastomer composites through precise control of print parameters, while maintaining geometric fidelity in the printed design.more » « less
-
Abstract Liquid metal composites are promising soft conductors for applications in soft electronics, sensors, and soft robotics. Existing liquid metal composites usually have a high‐volume fraction of liquid metal, which not only increases the density but also the material cost. Future applications in soft electronics and robotics highly demand liquid metal composites with low density and high conductivity for large‐scale, low‐cost, lightweight, and more sustainable applications. In this work, lightweight and highly conductive composites embedded with liquid metal fiber networks are synthesized. This new paradigm of liquid metal composites consists of an interconnected liquid metal fiber network embedded in a compliant rubber matrix. The liquid metal fiber network serves as an ultra‐lightweight conductive pathway for electrons. Experiments indicate that this soft conductive composite also possesses nearly strain‐insensitive conductance and superior cyclic stability. Potential applications of the composite films as stretchable interconnects, electrodes, and sensors are demonstrated.more » « less
-
NA (Ed.)Conductive adhesives are required for the integration of dissimilar material components to create soft electronic and robotic systems. Here, a heterogeneous liquid metal‐based conductive adhesive is developed that reversibly attaches to diverse surfaces with high stretchability (>100% strain), low modulus (<100 kPa), and strain‐invariant electrical conductivity. This SofT integrated composite with tacK through liquid metal (STICK‐LM) adhesive consists of a heterogeneous graded film with a liquid metal‐rich side that is embossed at prescribed locations for electrical conductivity and an electrically insulating adhesive side for integration. Adhesion behavior is tuned for adhesion energies > 70 Jm−2(≈ 25x enhancement over unmodified composites) and described with a viscoelastic analysis, providing design guidelines for controllable yet reversible adhesion in electrically conductive systems. The architecture of STICK‐LM adhesives provides anisotropic and heterogeneous electrical conductivity and enables direct integration into soft functional systems. This is demonstrated with deformable fuses for robotic joints, repositionable electronics that rapidly attach on curvilinear surfaces, and stretchable adhesive conductors with nearly constant electrical resistance. This study provides a methodology for electrically conductive, reversible adhesives for electrical and mechanical integration of multicomponent systems in emerging technologies.more » « less
-
Abstract Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1K−1is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.more » « less
An official website of the United States government

