skip to main content
US FlagAn official website of the United States government
dot gov icon
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
https lock icon
Secure .gov websites use HTTPS
A lock ( lock ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.


Title: Over 600 V Lateral AlN-on-AlN Schottky Barrier Diodes with Ultra-Low Ideality Factor
Abstract This letter reports the demonstration of lateral AlN Schottky barrier diodes (SBDs) on single-crystal AlN substrates by metalorganic CVD (MOCVD) with an ultra-low ideality factor (η) of 1.65, a high Schottky barrier height of 1.94 eV, a breakdown voltage (BV) of 640 V, and a record high normalizedBVby the anode-to-cathode distance. The device current was dominated by thermionic emission, while most previously reported AlN SBDs suffered from defect-induced current with higherη(>4). This work represents a significant step towards high-performance ultra-wide bandgap AlN-based high-voltage and high-power devices.  more » « less
Award ID(s):
2338604
PAR ID:
10522784
Author(s) / Creator(s):
; ; ; ;
Publisher / Repository:
DOI PREFIX: 10.35848
Date Published:
Journal Name:
Applied Physics Express
Volume:
17
Issue:
7
ISSN:
1882-0778
Format(s):
Medium: X Size: Article No. 074001
Size(s):
Article No. 074001
Sponsoring Org:
National Science Foundation
More Like this
  1. AlN Schottky barrier diodes with low ideality factor (<1.2), low differential ON-resistance (<0.6 mΩ cm2), high current density (>5 kA cm−2), and high breakdown voltage (680 V) are reported. The device structure consisted of a two-layer, quasi-vertical design with a lightly doped AlN drift layer and a highly doped Al0.75Ga0.25N ohmic contact layer grown on AlN substrates. A combination of simulation, current–voltage measurements, and impedance spectroscopy analysis revealed that the AlN/AlGaN interface introduces a parasitic electron barrier due to the conduction band offset between the two materials. This barrier was found to limit the forward current in fabricated diodes. Further, we show that introducing a compositionally-graded layer between the AlN and the AlGaN reduces the interfacial barrier and increases the forward current density of fabricated diodes by a factor of 104
    more » « less
  2. Lateral Schottky or heterojunction rectifiers were irradiated with 10 MeV protons and neutrons. For proton irradiation, the forward current of both types of rectifiers decreased by approximately an order of magnitude, with a corresponding increase in on-state resistance. The resultant on/off ratio improved after irradiation because of the larger decrease in reverse current compared to forward current. Both types of rectifiers displayed a shift in forward current and RON curves to lower voltages after irradiation. This could be due to defects created by neutron irradiation introducing deep energy levels within the bandgap of AlN. These deep levels can trap charge carriers, reducing their mobility and increasing the on-state resistance. Transmission electron microscopy showed disorder created at the AlN/NiO interface by neutron irradiation. TCAD simulation was used to study the effects of irradiation with both protons and neutrons. The results confirmed that the irradiation caused a significant reduction in electron concentration and a small increase in the recombination rate. Neutron irradiation can also introduce interface states at the metal or oxide-semiconductor junction of the rectifier. These interface states can modify the effective Schottky barrier height, affecting the forward voltage drop and on-state resistance. 
    more » « less
  3. We present a compositional dependence study of electrical characteristics of AlxGa1−xN quantum well channel-based AlN/AlGaN/AlN high electron mobility transistors (HEMTs) with x=0.25,0.44, and 0.58. This ultra-wide bandgap heterostructure is a candidate for next-generation radio frequency and power electronics. The use of selectively regrown n-type GaN Ohmic contacts results in contact resistance that increases as the Al content of the channel increases. The DC HEMT device characteristics reveal that the maximum drain current densities progressively reduce from 280 to 30 to 1.7 mA/mm for x=0.25,0.44, and 0.58, respectively. This is accompanied by a simultaneous decrease (in magnitude) in threshold voltage from −5.2 to −4.9 to −2.4 V for the three HEMTs. This systematic experimental study of the effects of Al composition x on the transistor characteristics provides valuable insights for engineering AlGaN channel HEMTs on AlN for extreme electronics at high voltages and high temperatures. 
    more » « less
  4. Near-ideal behavior in Schottky contacts to Si-doped AlN was observed as evidenced by a low ideality factor of 1.5 at room temperature. A temperature-independent Schottky barrier height of 1.9 eV was extracted from temperature-dependent I–V measurements. An activation energy of ∼300 meV was observed in the series resistance, which corresponded to the ionization energy of the deep Si donor state. Both Ohmic and Schottky contacts were stable up to 650 °C, with around four orders of magnitude rectification at this elevated temperature. These results demonstrate the potential of AlN as a platform for power devices capable of operating in extreme environments. 
    more » « less
  5. This work demonstrates quasi-vertical β-Ga2O3 Schottky barrier diodes (SBDs) fabricated on c-plane sapphire substrates using an all-low-pressure chemical vapor deposition (LPCVD)-based, plasma-free process flow that integrates both epitaxial growth of a high-quality β-Ga2O3 heteroepitaxial film with in situ Ga-assisted β-Ga2O3 etching. A 6.3 μm thick (2̄01) oriented β-Ga2O3 epitaxial layer structure was grown on c-plane sapphire with 6° miscut, comprising a moderately Si-doped (2.1 × 1017 cm−3) 3.15 μm thick drift layer and a heavily doped (1 × 1019 cm−3) contact layer on an unintentionally doped buffer layer. Mesa isolation was achieved via Ga-assisted plasma-free LPCVD etching, producing ∼60° inclined mesa sidewalls with an etch depth of 3.6 μm. The fabricated SBDs exhibited excellent forward current–voltage characteristics, including a turn-on voltage of 1.22 V, an ideality factor of 1.29, and a Schottky barrier height of 0.83 eV. The minimum differential specific on-resistance was measured to be 8.6 mΩ cm2, and the devices demonstrated high current density capability (252 A/cm2 at 5 V). Capacitance–voltage analysis revealed a net carrier concentration of 2.1 × 1017 cm−3, uniformly distributed across the β-Ga2O3 drift layer. Temperature-dependent J–V–T measurements, conducted from 25 to 250 °C, revealed thermionic emission-dominated transport with strong thermal stability. The Schottky barrier height increased from 0.80 to 1.16 eV, and the ideality factor rose modestly from 1.31 to 1.42 over this temperature range. Reverse leakage current remained low, increasing from ∼5 × 10−6 A/cm2 at 25 °C to ∼1 × 10−4 A/cm2 at 250 °C, with the Ion/Ioff ratio decreasing from ∼1 × 107 to 5 × 105. The devices achieved breakdown voltages ranging from 73 to 100 V, corresponding to parallel-plate electric field strengths of 1.66–1.94 MV/cm. These results highlight the potential of LPCVD-grown and etched β-Ga2O3 devices for high-performance, thermally resilient power electronics applications. 
    more » « less