Al_Keyyam, Ibrahim, Rahbar, Mahya, Shi, Enzheng, Li, Baini, Wang, Tianyu, and Wang, Xinwei. Thermal Conductance between <6 nm Single-Walled Carbon Nanotube Bundle and Si Substrate. Retrieved from https://par.nsf.gov/biblio/10524706. The Journal of Physical Chemistry C 128.3 Web. doi:10.1021/acs.jpcc.3c07572.

Al_Keyyam, Ibrahim, Rahbar, Mahya, Shi, Enzheng, Li, Baini, Wang, Tianyu, & Wang, Xinwei. Thermal Conductance between <6 nm Single-Walled Carbon Nanotube Bundle and Si Substrate. The Journal of Physical Chemistry C, 128 (3). Retrieved from https://par.nsf.gov/biblio/10524706. https://doi.org/10.1021/acs.jpcc.3c07572

Al_Keyyam, Ibrahim, Rahbar, Mahya, Shi, Enzheng, Li, Baini, Wang, Tianyu, and Wang, Xinwei. "Thermal Conductance between <6 nm Single-Walled Carbon Nanotube Bundle and Si Substrate". The Journal of Physical Chemistry C 128 (3). Country unknown/Code not available: RSC. https://doi.org/10.1021/acs.jpcc.3c07572. https://par.nsf.gov/biblio/10524706.

@article{osti_10524706,
place = {Country unknown/Code not available}, title = {Thermal Conductance between <6 nm Single-Walled Carbon Nanotube Bundle and Si Substrate}, url = {https://par.nsf.gov/biblio/10524706}, DOI = {10.1021/acs.jpcc.3c07572}, abstractNote = {}, journal = {The Journal of Physical Chemistry C}, volume = {128}, number = {3}, publisher = {RSC}, author = {Al_Keyyam, Ibrahim and Rahbar, Mahya and Shi, Enzheng and Li, Baini and Wang, Tianyu and Wang, Xinwei}, }