Abstract The demonstration of epitaxial thin film transfer has enormous potential for thin film devices free from the traditional substrate epitaxy limitations. However, large‐area continuous film transfer remains a challenge for the commonly reported polymer‐based transfer methods due to bending and cracking during transfer, especially for highly strained epitaxial thin films. In this work, a new epoxy‐based, rigid transfer method is used to transfer films from an SrTiO3(STO) growth substrate onto various new substrates, including those that will typically pose significant problems for epitaxy. An epitaxial multiferroic Bi3Fe2Mn2Ox(BFMO) layered supercell (LSC) material is selected as the thin film for this demonstration. The results of surface and structure studies show an order of magnitude increase in the continuous area of transferred films when compared to previous transfer methods. The magnetic properties of the BFMO LSC films are shown to be enhanced by the release of strain in this method, and ferromagnetic resonance is found with an exceptionally low Gilbert damping coefficient. The large‐area transfer of this highly strained complex oxide BFMO thin film presents enormous potential for the integration of many other multifunctional oxides onto new substrates for future magnetic sensors and memory devices. 
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                            Large Area Transfer of Bismuth‐Based Layered Oxide Thin Films Using a Flexible Polymer Transfer Method
                        
                    
    
            Magnetic and ferroelectric oxide thin films have long been studied for their applications in electronics, optics, and sensors. The properties of these oxide thin films are highly dependent on the film growth quality and conditions. To maximize the film quality, epitaxial oxide thin films are frequently grown on single‐crystal oxide substrates such as strontium titanate (SrTiO3) and lanthanum aluminate (LaAlO3) to satisfy lattice matching and minimize defect formation. However, these single‐crystal oxide substrates cannot readily be used in practical applications due to their high cost, limited availability, and small wafer sizes. One leading solution to this challenge is film transfer. In this demonstration, a material from a new class of multiferroic oxides is selected, namely bismuth‐based layered oxides, for the transfer. A water‐soluble sacrificial layer of Sr3Al2O6is inserted between the oxide substrate and the film, enabling the release of the film from the original substrate onto a polymer support layer. The films are transferred onto new substrates of silicon and lithium niobate (LiNbO3) and the polymer layer is removed. These substrates allow for the future design of electronic and optical devices as well as sensors using this new group of multiferroic layered oxide films. 
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                            - PAR ID:
- 10528439
- Publisher / Repository:
- Wiley
- Date Published:
- Journal Name:
- Small Science
- Edition / Version:
- 1
- ISSN:
- 2688-4046
- Format(s):
- Medium: X Size: 2MB Other: PDF-A
- Size(s):
- 2MB
- Sponsoring Org:
- National Science Foundation
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