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Title: Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
Abstract

A thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger (HX), where air is cooled by evaporating refrigerant. This work builds on a previously published two-dimensional (2D) model for the finned-tube HX by updating and validating the model using in-house experimental data collected from the proposed system using R1233zd(E) as the working fluid. The results show that key system variables such as refrigerant outlet quality, air and refrigerant outlet temperatures, and exchanger duty agree within 20% of their experimental counterparts. The validated model is then used to predict the mean heat transfer coefficient on the refrigerant side for each tube in the direction of airflow, indicating a maximum heat transfer coefficient of nearly 1200 W/(m2 K) for a HX duty of 5.3 kW among the tested cases. The validated model therefore enables accurate predictions of HX performance and provides insights into improving the heat exchange efficiency and the corresponding system performance.

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Award ID(s):
2209691
NSF-PAR ID:
10537548
Author(s) / Creator(s):
; ; ; ;
Publisher / Repository:
ASME
Date Published:
Journal Name:
Journal of Electronic Packaging
Edition / Version:
146
Volume:
146
Issue:
2
ISSN:
1043-7398
Subject(s) / Keyword(s):
Heat Exchanger Data Center
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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