Park, Junyong, Li, Chaofeng, Mok, Eddie, Dickson, Joe, Tourné, Joan, Thurairajaratnam, Aritharan, and Kim, DongHyun. A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model. Retrieved from https://par.nsf.gov/biblio/10566608. IEEE Transactions on Signal and Power Integrity 3. Web. doi:10.1109/TSIPI.2024.3391210.

Park, Junyong, Li, Chaofeng, Mok, Eddie, Dickson, Joe, Tourné, Joan, Thurairajaratnam, Aritharan, & Kim, DongHyun. A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model. IEEE Transactions on Signal and Power Integrity, 3 (). Retrieved from https://par.nsf.gov/biblio/10566608. https://doi.org/10.1109/TSIPI.2024.3391210

Park, Junyong, Li, Chaofeng, Mok, Eddie, Dickson, Joe, Tourné, Joan, Thurairajaratnam, Aritharan, and Kim, DongHyun. "A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model". IEEE Transactions on Signal and Power Integrity 3 (). Country unknown/Code not available: IEEE. https://doi.org/10.1109/TSIPI.2024.3391210. https://par.nsf.gov/biblio/10566608.

@article{osti_10566608,
place = {Country unknown/Code not available}, title = {A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model}, url = {https://par.nsf.gov/biblio/10566608}, DOI = {10.1109/TSIPI.2024.3391210}, abstractNote = {}, journal = {IEEE Transactions on Signal and Power Integrity}, volume = {3}, publisher = {IEEE}, author = {Park, Junyong and Li, Chaofeng and Mok, Eddie and Dickson, Joe and Tourné, Joan and Thurairajaratnam, Aritharan and Kim, DongHyun}, }