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Title: Experimental Study of PCB Vibration Induced by MLCC Assembly Orientation and Process Variations
Award ID(s):
1916535
PAR ID:
10566628
Author(s) / Creator(s):
; ; ; ; ; ;
Publisher / Repository:
IEEE
Date Published:
ISBN:
979-8-3503-6039-4
Page Range / eLocation ID:
110 to 113
Format(s):
Medium: X
Location:
Phoenix, AZ, USA
Sponsoring Org:
National Science Foundation
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