High-Throughput Assembly of Compositionally Controlled 3D Cell Communities for Developmental Engineering
- Award ID(s):
- 2047271
- PAR ID:
- 10583410
- Publisher / Repository:
- Springer US
- Date Published:
- Page Range / eLocation ID:
- 31 to 50
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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