Liu, Shuwan, Chong, Su Kong, Kim, Dongwook, Vashist, Amit, Kumar, Rohit, Lee, Seng Huat, Wang, Kang L, Mao, Zhiqiang, Liu, Feng, and Deshpande, Vikram V. Nanomechanical Characterization of an Antiferromagnetic Topological Insulator. Retrieved from https://par.nsf.gov/biblio/10584880. Nano Letters 25.3 Web. doi:10.1021/acs.nanolett.4c04086.

Liu, Shuwan, Chong, Su Kong, Kim, Dongwook, Vashist, Amit, Kumar, Rohit, Lee, Seng Huat, Wang, Kang L, Mao, Zhiqiang, Liu, Feng, & Deshpande, Vikram V. Nanomechanical Characterization of an Antiferromagnetic Topological Insulator. Nano Letters, 25 (3). Retrieved from https://par.nsf.gov/biblio/10584880. https://doi.org/10.1021/acs.nanolett.4c04086

Liu, Shuwan, Chong, Su Kong, Kim, Dongwook, Vashist, Amit, Kumar, Rohit, Lee, Seng Huat, Wang, Kang L, Mao, Zhiqiang, Liu, Feng, and Deshpande, Vikram V. "Nanomechanical Characterization of an Antiferromagnetic Topological Insulator". Nano Letters 25 (3). Country unknown/Code not available: ACS Publications. https://doi.org/10.1021/acs.nanolett.4c04086. https://par.nsf.gov/biblio/10584880.

@article{osti_10584880,
place = {Country unknown/Code not available}, title = {Nanomechanical Characterization of an Antiferromagnetic Topological Insulator}, url = {https://par.nsf.gov/biblio/10584880}, DOI = {10.1021/acs.nanolett.4c04086}, abstractNote = {}, journal = {Nano Letters}, volume = {25}, number = {3}, publisher = {ACS Publications}, author = {Liu, Shuwan and Chong, Su Kong and Kim, Dongwook and Vashist, Amit and Kumar, Rohit and Lee, Seng Huat and Wang, Kang L and Mao, Zhiqiang and Liu, Feng and Deshpande, Vikram V}, }