Cheng, Justin Y, Li, Zezhou, Poerschke, David L, Baldwin, J Kevin, Bresnahan, Brady L, and Mara, Nathan A. Thermal stability of 3D interface Cu/Nb nanolaminates. Retrieved from https://par.nsf.gov/biblio/10590032. Scripta Materialia 254.C Web. doi:10.1016/j.scriptamat.2024.116319.

Cheng, Justin Y, Li, Zezhou, Poerschke, David L, Baldwin, J Kevin, Bresnahan, Brady L, & Mara, Nathan A. Thermal stability of 3D interface Cu/Nb nanolaminates. Scripta Materialia, 254 (C). Retrieved from https://par.nsf.gov/biblio/10590032. https://doi.org/10.1016/j.scriptamat.2024.116319

Cheng, Justin Y, Li, Zezhou, Poerschke, David L, Baldwin, J Kevin, Bresnahan, Brady L, and Mara, Nathan A. "Thermal stability of 3D interface Cu/Nb nanolaminates". Scripta Materialia 254 (C). Country unknown/Code not available: Scr. Mater.. https://doi.org/10.1016/j.scriptamat.2024.116319. https://par.nsf.gov/biblio/10590032.

@article{osti_10590032,
place = {Country unknown/Code not available}, title = {Thermal stability of 3D interface Cu/Nb nanolaminates}, url = {https://par.nsf.gov/biblio/10590032}, DOI = {10.1016/j.scriptamat.2024.116319}, abstractNote = {}, journal = {Scripta Materialia}, volume = {254}, number = {C}, publisher = {Scr. Mater.}, author = {Cheng, Justin Y and Li, Zezhou and Poerschke, David L and Baldwin, J Kevin and Bresnahan, Brady L and Mara, Nathan A}, }