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Intrinsic residual stresses in woven composites result from the coefficient of thermal expansion mismatch between the fibers and the matrix. Extrinsic residual stresses result from large scale thermal gradients during curing and cooling. Intrinsic residual stresses in 3D woven composites are sometimes severe enough to cause micro-cracking in the matrix. They are also expected to impact the fatigue resistance and the impact resistance. To the best of our knowledge, there have been no spatially resolved measurements of the intrinsic residual stress field as a function of position in the repeating weave pattern. We used digital image correlation (DIC) and electronic speckle pattern interferometry (ESPI) to measure the surface displacement field resulting from drilling a 1 mm diameter hole at four selected locations in two different 3D woven composite architectures that represent low and high through-the-thickness constraint. The two methods are used because the displacements sometimes on the lower end of the resolution for the DIC method and the displacement gradients are sometimes too steep to resolve the fringes for the ESPI method. Finite element models constructed with realistic fiber geometry using Dynamic Fabric Mechanic Analyzer software were utilized to estimate the residual stress field from cooling from the curing temperature. Holes were manually inserted by deactivating the elements in the hole region and the resultant displacement fields were compared to the measurements. In general, the measured displacement fields were lower in magnitude than the model predictions. In some cases, the sign of the predicted displacement field is opposite to the observed field which could be attributed to differences between the actual hole location and the hole in the model.
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Chemical Shrinkage Characterization during Curing through Three-Dimensional Digital Image Correlation
Chemical shrinkage in thermosetting polymers drives residual stress development and induces residual deformation in composite materials. Accurate characterization of chemical shrinkage during curing is therefore vital to minimize residual stresses through process modeling and optimize composite performance. This work introduces a novel methodology to measure the pre- and post-gelation chemical shrinkage of an epoxy resin using three-dimensional digital image correlation (3D-DIC). Differential scanning calorimetry (DSC) is employed to calculate reaction kinetics and correlate chemical shrinkage with the degree of cure. Rheology experiments are conducted to quantify gelation and validate post-gelation. 3D-DIC post-gelation results show excellent agreement with rheology. Pre-gelation results show the effect of the in-situ curing in the proximity of constraints on the global strain behavior. This work introduced an innovative approach to characterize the chemical shrinkage of thermosets during curing, which will enable accurate residual stress prediction for enhancing thermoset composite performance and provide insight into the in-situ polymer behavior during processing.
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- Award ID(s):
- 2145387
- PAR ID:
- 10613706
- Publisher / Repository:
- ChemRxv
- Date Published:
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Posted Content:
- https://doi.org/10.26434/chemrxiv-2023-6xg1d
