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Title: A Flexible Hybrid Interconnection Design for High-Performance and Energy-Efficient Chiplet-Based Systems
Award ID(s):
2245950 2321225 2321224
PAR ID:
10631661
Author(s) / Creator(s):
;
Publisher / Repository:
IEEE
Date Published:
Journal Name:
IEEE Computer Architecture Letters
Volume:
23
Issue:
2
ISSN:
1556-6056
Page Range / eLocation ID:
215 to 218
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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