Lee, Seung Yoon, Lee, Dongseop, Zhang, Yueping, Hong, Wonbin, and Ghalichechian, Nima. History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer solutions. Retrieved from https://par.nsf.gov/biblio/10634748. IEEE Antennas and Propagation Magazine 67.3 Web. doi:10.1109/MAP.2025.3560852.

Lee, Seung Yoon, Lee, Dongseop, Zhang, Yueping, Hong, Wonbin, & Ghalichechian, Nima. History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer solutions. IEEE Antennas and Propagation Magazine, 67 (3). Retrieved from https://par.nsf.gov/biblio/10634748. https://doi.org/10.1109/MAP.2025.3560852

Lee, Seung Yoon, Lee, Dongseop, Zhang, Yueping, Hong, Wonbin, and Ghalichechian, Nima. "History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer solutions". IEEE Antennas and Propagation Magazine 67 (3). Country unknown/Code not available: IEEE Antennas and Propagation Magazine. https://doi.org/10.1109/MAP.2025.3560852. https://par.nsf.gov/biblio/10634748.

@article{osti_10634748,
place = {Country unknown/Code not available}, title = {History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer solutions}, url = {https://par.nsf.gov/biblio/10634748}, DOI = {10.1109/MAP.2025.3560852}, abstractNote = {}, journal = {IEEE Antennas and Propagation Magazine}, volume = {67}, number = {3}, publisher = {IEEE Antennas and Propagation Magazine}, author = {Lee, Seung Yoon and Lee, Dongseop and Zhang, Yueping and Hong, Wonbin and Ghalichechian, Nima}, }