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This content will become publicly available on August 1, 2026

Title: REBCO Delamination Characterization by 90 Degree Peel Test
Award ID(s):
2131790
PAR ID:
10635977
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
IEEE
Date Published:
Journal Name:
IEEE Transactions on Applied Superconductivity
Volume:
35
Issue:
5
ISSN:
1051-8223
Page Range / eLocation ID:
1 to 5
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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