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  • Ultra-fast rotary ultrasonic micro-hole machining of silicon wafers: a comparative study between twist drill and diamond tools

This content will become publicly available on August 4, 2026

Title: Ultra-fast rotary ultrasonic micro-hole machining of silicon wafers: a comparative study between twist drill and diamond tools
Award ID(s):
2102181
PAR ID:
10643340
Author(s) / Creator(s):
; ;
Publisher / Repository:
ELSEVIER
Date Published:
Journal Name:
Ultrasonics
Volume:
156
ISSN:
0041-624X
Page Range / eLocation ID:
107776
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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