Sahoo, Krutikesh, Harish, Vineeth, Liu, Jui-Han, Irwin, Randall, Yang, Cheng-Ting Michael, Sun, Henry, and Iyer, Subramanian S. Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets. Retrieved from https://par.nsf.gov/biblio/10652501. Web. doi:10.1109/ECTC51529.2024.00329.

Sahoo, Krutikesh, Harish, Vineeth, Liu, Jui-Han, Irwin, Randall, Yang, Cheng-Ting Michael, Sun, Henry, & Iyer, Subramanian S. Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets. Retrieved from https://par.nsf.gov/biblio/10652501. https://doi.org/10.1109/ECTC51529.2024.00329

Sahoo, Krutikesh, Harish, Vineeth, Liu, Jui-Han, Irwin, Randall, Yang, Cheng-Ting Michael, Sun, Henry, and Iyer, Subramanian S. "Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets". Country unknown/Code not available: IEEE. https://doi.org/10.1109/ECTC51529.2024.00329. https://par.nsf.gov/biblio/10652501.

@article{osti_10652501,
place = {Country unknown/Code not available}, title = {Aluminum to copper thermal compression bonding for heterogeneous integration of legacy dielets}, url = {https://par.nsf.gov/biblio/10652501}, DOI = {10.1109/ECTC51529.2024.00329}, abstractNote = {Abstract in attached file}, journal = {}, publisher = {IEEE}, author = {Sahoo, Krutikesh and Harish, Vineeth and Liu, Jui-Han and Irwin, Randall and Yang, Cheng-Ting Michael and Sun, Henry and Iyer, Subramanian S}, }