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This content will become publicly available on July 19, 2026

Title: Analysis of a 3D Integrated Superconducting Quantum Chip Structure
Award ID(s):
2125906
PAR ID:
10656963
Author(s) / Creator(s):
;
Publisher / Repository:
2025 IEEE International Conference on Quantum Computing and Engineering (QCE)
Date Published:
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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