Search for: All records

Characteristic electrical transport analysis of textured ferroelectric wurtzite Al1−xHfxN (x = 0.00,  0.07,  0.14,  0.28,  0.42) thin films was performed using temperature-dependent leakage current measurements on Mo/Al1−xHfxN/Mo/SiC capacitors. A unified analysis couples (i) slope-magnitude comparisons against the theoretical forms for conduction mechanisms of Poole–Frenkel, Schottky, and fixed-range hopping, (ii) extractions of effective energy barriers via Arrhenius fits with variable applied E-field when applicable, and (iii) low-field ohmic fits. Low-field response is ohmic for all x, while compositions with increasing x show an increase in the E-field value at which ohmic-to-non-ohmic onset occurs. The unified analysis shows a trend of high-field electrical transport shifting from interface limited (Schottky) to bulk limited (Poole–Frenkel) conduction with increasing x. A resulting conduction mechanism map illustrates this gradual composition-driven change from interface to bulk limited. This is consistent with HfAl acting as deep trap states, though mechanistic details require additional investigation. 

Advances in wurtzite nitride ferroelectrics of Al1−xMxN (M = Sc or B) have led to novel capabilities, which must be integrated into existing fabrication processes. In the case of electronics operating >200°C, a movement toward SiC-based platforms enables better performance over conventional Si, primarily due to the higher bandgap and lower intrinsic carrier concentration of SiC. Hence, the challenge is to develop a deposition process to integrate Al1−xMxN ferroelectrics with elevated temperature-compatible materials for high temperature electronics such as the non-volatile memory component. We demonstrate epitaxial AlMN/Mo/SiC heterostructures, which provides both the crystalline and surface features that promote high-quality ferroelectric nitride film growth. Omega scans of the Mo (110) reflection exhibit a full width at half max of <0.02° (40 arc sec) and the (0002) peak of the subsequently grown nitride film had a value of 1.1° for 160 nm thick Al0.7Sc0.3N and 1.3° for 400 nm thick Al0.94B0.06N. The crystallographic relationships found between the AlMN, Mo, and SiC layers indicate an advancement in sputter deposition of epitaxial films. Ferroelectric switching is also shown at 400 °C in both samples via polarization-electric field hysteresis and pulsed measurements, which exhibited Pr values >100 μC cm−2 and Ec between 3 and 4 MV cm−1, despite a large presence of oxygen in both AlMN films ranging between 4 and 5 at.%, revealed by compositional analysis. This study demonstrates the process for synthesizing high-crystal quality ferroelectric nitride films, which can be used in extremely high temperature applications. 

Thin films of aluminum hafnium nitride (Al1−xHfxN) were synthesized via reactive magnetron sputtering for Hf contents up to x = 0.13. X-ray diffraction showed a single c-axis oriented wurtzite phase for all films. Hard x-ray photoelectron spectroscopy demonstrated homogeneous Al:Hf distribution through the thin films and confirmed their insulating character. A collection of complementary tests showed unambiguous polarization inversion, and thus ferroelectricity in multiple samples. Current density vs electric field hysteresis measurements showed distinct ferroelectric switching current peaks, the piezoelectric coefficient d33,f,meas measured using a double beam laser interferometer (DBLI) showed a reversal in sign with similar magnitude, and anisotropic wet etching confirmed field-induced polarization inversion. This demonstrates the possibility of using tetravalent–and not just trivalent–alloying elements to enable ferroelectricity in AlN-based thin films, highlighting the compositional flexibility of ferroelectricity in wurtzites and greatly expanding the chemistries that can be considered for future devices. 

Abstract Wurtzite ferroelectric materials are promising candidates for energy‐efficient memory technologies, particularly for applications requiring high operating temperatures. Asymmetric wake‐up behaviors, in which the polarization reversal depends both on polarity and cycle number for the first few dozen cycles, must be better understood for reliable device operation. Here, the detailed analysis of the asymmetric wake‐up behavior of thin film Al_0.94B_0.06N was performed combining time‐resolved switching measurements with Rayleigh analysis, piezoelectric measurements, and etching experiments of progressively switched samples. The analysis shows that the gradual opening of the polarization hysteresis loops associated with wake‐up is driven by a gradual increase in the domain‐wall density and/or domain‐wall mobility with electric field cycle to the polarity opposite to the growth polarity. The insights of this discovery will help to guide interface and polarity design in the eventual deployment of reliable devices based on these materials.