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Lack of fusion (LOF) is a dominant defect in Laser Powder-Bed Fusion (PBF-LB/M) caused by insufficient overlapping between adjacent melt pools. This study introduces a rapid, first-principles model based on Rosenthal’s analytical solution for a moving point heat source to predict melt pool geometry. Using geometric criteria, the model evaluates whether the melt pool width exceeds the hatching distance and whether the melt pool depth exceeds the layer thickness. Based on these conditions, LOF-based process windows are constructed by plotting laser power against scanning speed and classifying each parameter combination as either LOF or no LOF. The process developed here for constructing LOF process windows can be applied to metallic PBF-LB/M systems. As PBF-LB/M of copper is commonly associated with LOF defects, the approach is examined for pure copper by evaluating a range of laser powers and scanning speeds for both near-infrared (NIR) (1064 nm) and green (515 nm) lasers using copper-specific absorptivity values. The resulting process windows are validated against literature-reported relative density data for pure copper, using high relative density values as indicators of full fusion and lower relative density values reported with LOF characteristics as indicators of lack of fusion. For a 30 µm layer thickness, the predicted LOF boundary agreed with 43 of 46 literature-reported copper PBF-LB/M data points when the data were classified using relative density and reported defect morphology. Sensitivity analysis showed that the agreement changed modestly when the relative-density threshold was reduced from 99% to 98.5% and 98% and that near-boundary classifications were sensitive to the selected absorptivity within the reported NIR range. The agreement supports the use of the framework as a preliminary screening tool for identifying LOF-prone parameter regions. By providing a fast, physics-based screening tool for LOF-limited process windows, this framework offers a computationally efficient alternative to high-fidelity numerical simulations commonly used in PBF-LB/M process development. 

Additive manufacturing (AM) of polyetheretherketone (PEEK) offers a promising route for producing lightweight, biocompatible, and patient-specific medical implants with complex geometries. This study investigates and optimizes fused deposition modeling (FDM) parameters for fabricating small-scale PEEK medical components with improved dimensional accuracy and surface quality. PEEK’s high processing temperature and thermal contraction make precision printing of fine features challenging. A Taguchi design of experiments (L9 orthogonal array) was employed to assess the effects of nozzle temperature, layer height, printing speed, and extrusion width on dimensional deviation and surface roughness using 5 × 5 × 5 mm cube specimens. Dimensional accuracy was quantified along the horizontal and vertical axes, and surface roughness was measured using a stylus profilometer. Statistical analysis showed layer height was the most significant factor affecting horizontal accuracy (p = 0.0225), while printing speed most strongly influenced vertical deviation. The optimal parameters, 450 °C nozzle temperature, 0.06 mm layer height, 7.5 mm/s printing speed, and 0.4 mm extrusion width, achieved mean deviations of 0.013 mm (horizontal) and 0.049 mm (vertical) with a surface roughness of 4.01 µm. Validation using a benchmark model and micro-computed tomography confirmed improved reproduction of small features under these conditions. The results demonstrate that precise control of FDM parameters enables accurate fabrication of sub-millimeter PEEK structures suitable for medical device applications. 

Powder bed fusion of copper has been extensively investigated using both laser-based (PBF-LB/M) and electron beam-based (PBF-EB/M) additive manufacturing technologies. Each technique offers unique benefits as well as specific limitations. Near-infrared (NIR) laser-based LPBF is widely accessible; however, the high reflectivity of copper limits energy absorption, thereby resulting in a narrow processing window. Although optimized parameters can yield relative densities above 97%, issues such as keyhole porosity, incomplete melting, and anisotropy remain concerns. Green lasers, with higher absorptivity in copper, offer broader process windows and enable more consistent fabrication of high-density parts with superior electrical conductivity, often reaching or exceeding 99% relative density and 100% International Annealed Copper Standard (IACS). Mechanical properties, including tensile and yield strength, are also improved, though challenges remain in surface finish and geometrical resolution. In contrast, Electron Beam Powder Bed Fusion (EB-PBF) uses high-energy electron beams in a vacuum, eliminating oxidation and leveraging copper’s high conductivity to achieve high energy absorption at lower volumetric energy densities (~80 J/mm3). This results in consistently high relative densities (>99.5%) and excellent electrical and thermal conductivity, with additional benefits including faster scanning speeds and in situ monitoring capabilities. However, EB-PBF processes in general face their own limitations, such as surface roughness and powder smoking. This paper provides a comprehensive review of the current state of laser-based (PBF-LB/M) and electron beam-based (PBF-EB/M) powder bed fusion processes for the additive manufacturing of copper, summarizing key trends, material properties, and process innovations. Both approaches continue to evolve, with ongoing research aimed at refining these technologies to enable the reliable and efficient additive manufacturing of high-performance copper components. 

Applications of Copper (Cu) range from small scale applications such as microelectronics interconnects to very large high-powered applications such as railguns. In all these applications, Cu conductivity and ampacity play vital roles. In some applications such as railguns, where Cu also plays a structural role, not only is high conductivity needed, but high strength, high ductility, and high wear resistance are also critical. Current technologies have achieved their full potential for producing better materials. New approaches and technologies are needed to develop superior properties. This research examines a new fabrication approach that is expected to produce Cu with superior mechanical strength, enhanced wear resistance, and increased electrical conductivity. Materials with refined grain structures were obtained by breaking down the coarse-grained Cu particles via cryogenic ball milling, followed by the consolidation of powders using cold isostatic pressing (CIP) and subsequent Continuous Equal Channel Angular Pressing (C-ECAP). The mixture of fine and ultrafine grains, with sizes between 200 nm to 2.5 µm and an average of 500 nm, was formed after ball milling at cryogenic temperatures. Further processing via C-ECAP produced nanostructured Cu with average grain sizes below 50 nm and excellent homogenous equiaxed grain shapes and random orientations. The hardness and tensile strength of the final Cu were approximately 158% and 95% higher than the traditional coarse-grained Cu bar, respectively. This material also displayed a good electrical conductivity rate of 74% International Annealed Copper Standard (IACS), which is comparable to the current Cu materials used in railgun applications. 

Additive manufacturing (AM) as a disruptive technique has offered great potential to design and fabricate many metallic components for aerospace, medical, nuclear, and energy applications where parts have complex geometry. However, a limited number of materials suitable for the AM process is one of the shortcomings of this technique, in particular laser AM of copper (Cu) is challenging due to its high thermal conductivity and optical reflectivity, which requires higher heat input to melt powders. Fabrication of composites using AM is also very challenging and not easily achievable using the current powder bed technologies. Here, the feasibility to fabricate pure copper and copper-carbon nanotube (Cu-CNT) composites was investigated using laser powder bed fusion additive manufacturing (LPBF-AM), and 10 × 10 × 10 mm3 cubes of Cu and Cu-CNTs were made by applying a Design of Experiment (DoE) varying three parameters: laser power, laser speed, and hatch spacing at three levels. For both Cu and Cu-CNT samples, relative density above 90% and 80% were achieved, respectively. Density measurement was carried out three times for each sample, and the error was found to be less than 0.1%. Roughness measurement was performed on a 5 mm length of the sample to obtain statistically significant results. As-built Cu showed average surface roughness (Ra) below 20 µm; however, the surface of AM Cu-CNT samples showed roughness values as large as 1 mm. Due to its porous structure, the as-built Cu showed thermal conductivity of ~108 W/m·K and electrical conductivity of ~20% IACS (International Annealed Copper Standard) at room temperature, ~70% and ~80% lower than those of conventionally fabricated bulk Cu. Thermal conductivity and electrical conductivity were ~85 W/m·K and ~10% IACS for as-built Cu-CNT composites at room temperature. As-built Cu-CNTs showed higher thermal conductivity as compared to as-built Cu at a temperature range from 373 K to 873 K. Because of their large surface area, light weight, and large energy absorbing behavior, porous Cu and Cu-CNT materials can be used in electrodes, catalysts and their carriers, capacitors, heat exchangers, and heat and impact absorption.