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Abstract Optical phase modulators are critical components in integrated photonics, but conventional designs suffer from a trade-off between modulation efficiency and optical loss. Two-dimensional materials like graphene offer strong electro-optic effects, yet their high optical absorption at telecom wavelengths leads to significant insertion losses. Although monolayer transition metal dichalcogenides (TMDs) provide exceptional telecom-band transparency for low-loss electro-refractive response, their practical implementation in phase modulators requires top electrodes to enable vertical electric field tuning, which typically introduces parasitic absorption. Here, we address this challenge by developing hybrid tungsten oxyselenide/graphene (TOS/Gr) electrodes that minimize optical loss while enabling efficient phase modulation in TMD-based devices. The UV-ozone-converted TOS (from WSe₂) acts as a heavy p-type dopant for graphene, making the graphene transparent in the NIR region while enhancing its conductivity. Our complete device integrates a hybrid TOS/graphene transparent electrode with a hexagonal boron nitride dielectric spacer and monolayer WS₂electro-optic material on a SiN microring platform. This achieves a high modulation efficiency of 0.202 V·cm while maintaining an exceptionally low extinction ratio change of just 0.08 dB, demonstrating superior performance compared to modulators employing conventional electrodes. Our breakthrough in near-lossless phase modulation opens new possibilities for energy-efficient optical communications, photonic computing, and fault-tolerant quantum networks. 

Abstract Ferrimagnetic iron garnets enable magnetic and magneto‐optical functionality in silicon photonics and electronics. However, garnets require high‐temperature processing for crystallization which can degrade other devices on the wafer. Here bismuth‐substituted yttrium and terbium iron garnet (Bi‐YIG and Bi‐TbIG) films are demonstrated with good magneto‐optical performance and perpendicular magnetic anisotropy (PMA) crystallized by a microheater built on a Si chip or by rapid thermal annealing. The Bi‐TbIG film crystallizes on Si at 873 K without a seed layer and exhibits good magneto‐optical properties with Faraday rotation (FR) of −1700 deg cm⁻¹. The Bi‐YIG film also crystallizes on Si and fused SiO₂at 873 K without a seed layer. Rapidly cooled films exhibit PMA due to the tensile stress caused by the thermal expansion mismatch with the substrates, increasing the magnetoelastic anisotropy by 4 kJ m⁻³versus slow‐cooled films. Annealing in the air for 15 s using the microheater yields fully crystallized Bi‐TbIG on the Si chip. 

Abstract Chalcogenide optical phase change materials (PCMs) have garnered significant interest for their growing applications in programmable photonics, optical analog computing, active metasurfaces, and beyond. Limited endurance or cycling lifetime is however increasingly becoming a bottleneck toward their practical deployment for these applications. To address this issue, a systematic study elucidating the cycling failure mechanisms of Ge₂Sb₂Se₄Te (GSST) is performed, a common optical PCM tailored for infrared photonic applications, in an electrothermal switching configuration commensurate with their applications in on‐chip photonic devices. Further a set of design rules building on insights into the failure mechanisms is proposed, and successfully implemented them to boost the endurance of the Ge₂Sb₂Se₄Te (GSST) device to over 67 000 cycles. 

As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly compact and functional sub-micrometer silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication processes and extensive photonic component libraries. The development of a highly efficient, scalable, and broadband coupling scheme for this platform is therefore of paramount importance. Leveraging two-photon polymerization (TPP) and a deterministic free-form micro-optics design methodology based on the Fermat’s principle, this work demonstrates an ultra-efficient and broadband 3-D coupler interface between standard SMF-28 single-mode fibers and silicon waveguides on the 220 nm SOI platform. The coupler achieves a low coupling loss of 0.8 dB for the fundamental TE mode, along with 1 dB bandwidth exceeding 180 nm. The broadband operation enables diverse bandwidth-driven applications ranging from communications to spectroscopy. Furthermore, the 3-D free-form coupler also enables large tolerance to fiber misalignments and manufacturing variability, thereby relaxing packaging requirements toward cost reduction capitalizing on standard electronic packaging process flows.