skip to main content

Search for: All records

Creators/Authors contains: "Zheng, Yixiong"

Note: When clicking on a Digital Object Identifier (DOI) number, you will be taken to an external site maintained by the publisher. Some full text articles may not yet be available without a charge during the embargo (administrative interval).
What is a DOI Number?

Some links on this page may take you to non-federal websites. Their policies may differ from this site.

  1. Abstract

    2D molecular entities build next-generation electronic devices, where abundant elements of organic molecules are attractive due to the modern synthetic and stimuli control through chemical, conformational, and electronic modifications in electronics. Despite its promising potential, the insufficient control over charge states and electronic stabilities must be overcome in molecular electronic devices. Here, we show the reversible switching of modulated charge states in an exfoliatable 2D-layered molecular conductor based on bis(ethylenedithio)tetrathiafulvalene molecular dimers. The multiple stimuli application of cooling rate, current, voltage, and laser irradiation in a concurrent manner facilitates the controllable manipulation of charge crystal, glass, liquid, and metal phases. The four orders of magnitude switching of electric resistance are triggered by stimuli-responsive charge distribution among molecular dimers. The tunable charge transport in 2D molecular conductors reveals the kinetic process of charge configurations under stimuli, promising to add electric functions in molecular circuitry.

  2. Free, publicly-accessible full text available May 1, 2023
  3. In this paper, we demonstrated large-size free-standing single-crystal β-Ga 2 O 3 NMs fabricated by the hydrogen implantation and lift-off process directly from MOCVD grown β-Ga 2 O 3 epifilms on native substrates. The optimum implantation conditions were simulated with a Monte-Carlo simulation method to obtain a high hydrogen concentration with a narrow ion distribution at the desired depth. Two as grown β-Ga 2 O 3 samples with different orientations ([100] and [001]) were used to successfully create 1.2 μm thick β-Ga 2 O 3 NMs without any physical damage. These β-Ga 2 O 3 NMs were then transfer-printed onto rigid and flexible substrates such as SiC and polyimide substrates. Various material characterization studies were performed to investigate their crystal quality, surface morphologies, optical properties, mechanical properties, and bandgaps before and after the lift-off and revealed that the good material quality was maintained. This result offers several benefits in that the thickness, doping, and size of β-Ga 2 O 3 NMs can be fully controlled. Moreover, more advanced β-Ga 2 O 3 -based NM structures such as (Al x Ga 1−x ) 2 O 3 /Ga 2 O 3 heterostructure NMs can be directly created from their bulk epitaxy substrates;more »thus this study provides a viable route for the realization of high performance β-Ga 2 O 3 NM-based electronics and optoelectronics that can be built on various substrates and platforms.« less
  4. Abstract

    In this work, we report a simplified method to measure thermal conductivity from the typical Raman thermometry method by employing a much simpler dispersion relationship equation and the Debye function, instead of solving the heat equation. Unlike the typical Raman thermometry method, our new method only requires monitoring of the temperature-dependent Raman mode shifting without considering laser power-dependent Raman mode shifting. Thus, this new calculation method offers a simpler way to calculate the thermal conductivity of materials with great precision. As a model system, theβ-Ga2O3nanomembrane (NM) on a diamond substrate was prepared to measure thermal conductivity ofβ-Ga2O3NMs at different thicknesses (100 nm, 1000 nm, and 4000 nm). Furthermore, the phonon penetration depth was investigated to understand how deep phonons can be dispersed in the sample so as to guide the dimensional design parameter of the device from the thermal management perspective.

  5. Theβ-Ga2O3nanomembrane (NM)/diamond heterostructure is one of the promising ultra-wide bandgap heterostructures that offers numerous complementary advantages from both materials. In this work, we have investigated the thermal properties of theβ-Ga2O3NM/diamond heterostructure with three different thicknesses ofβ-Ga2O3nanomembranes (NMs), namely 100 nm, 1000 nm, and 4000 nm thickβ-Ga2O3NMs using Raman thermometry. The thermal property—temperature relationships of theseβ-Ga2O3NM/diamond heterostructures, such as thermal conductivity and interfacial thermal boundary conductance were determined under different temperature conditions (from 100 K to 500 K with a 40 K interval). The result provides benchmark knowledge about the thermal conductivity ofβ-Ga2O3NMs over a wide temperature range for the design of novelβ-Ga2O3-based power electronics and optoelectronics.

  6. In this study, we demonstrate a tolerant and durable Cr/Ni bilayer metal etch mask that allows us to realize approximately 150:1 etch selectivity to diamond. This result is achieved through the use of a very thin initial Cr layer of <10 nm thickness as part of the bilayer metal mask, which results in five to ten times improved selectivity than thick single metal layer masks or bilayer masks with thicker combinations. A finite element analysis was employed to design and understand the physics and working mechanism of the bilayer metal masks with different thicknesses. Raman spectroscopy and energy-dispersive x-ray spectroscopy on the diamond surface were also performed to investigate the changes in diamond quality before and after the deep diamond etching and found that no noticeable etch damage or defects were formed. Overall, this mask strategy offers a viable way to realize deep diamond etching using a high heat and chemistry tolerant and durable bilayer metal etching mask. It also offers several technological benefits and advantages, including various deposition method options, such as sputtering and physical vapor deposition, that can be used and the total thinness of the bilayer metal mask required given the higher selectivity allows us to realize finemore »diamond etching or high-aspect ratio etching, which is a critical fabrication process for future power, RF, MEMS, and quantum device applications.

    « less