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Award ID contains: 2023404

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  1. ; ; ; ; ; (, Journal of the American Ceramic Society)
    Abstract A novel high‐temperature laser shock peening (HT‐LSP) process was applied to polycrystalline α‐SiC to improve the mechanical performance. HT‐LSP prevents microcrack formation on the surface while induces plastic deformation in the form of dislocation slip on the basal planes, which may be caused by the combination of high shock pressure and a lower critical resolved shear stress at 1000℃. A maximum compressive residual stress of 650 MPa, measured with Raman spectroscopy, was introduced into the surface of α‐SiC by HT‐LSP, which can increase the nanohardness and in‐plane fracture toughness of α‐SiC by 8% and 36%, respectively. This work presents a fundamental base for the promising applications of HT‐LSP to brittle ceramics to increase their plasticity and mechanical properties. 
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  2. ; ; ; ; ; ; ; (, Advanced Engineering Materials)
    The concept for fabrication of waveguides by an in‐volume laser direct writing in single‐crystal silicon is explored using a nanosecond pulse laser. The key innovation of this technology relies on the generation of amorphous silicon, which has a higher refractive index than that of crystalline silicon. Herein, transmission electron microscopy (TEM) together with selected area electron diffraction (SAED) and high‐resolution TEM (HRTEM) characterizations are used to better understand the microstructural evolutions. TEM images reveal the core‐shell structures, while SAED patterns and HRTEM directly observe the presence of amorphous silicon in the core surrounded by a crystalline silicon shell. With a lower laser scanning speed, a higher density of defects yet less amorphous silicon is formed by laser direct writing. 
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