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The threat of (HTs) and their detection is a widely studied field. While the effort for inserting a Trojan into an (ASIC) can be considered relatively high, especially when trusting the chip manufacturer, programmable hardware is vulnerable to Trojan insertion even after the product has been shipped or during usage. At the same time, detecting dormant HTs with small or zero-overhead triggers and payloads on these platforms is still a challenging task, as the Trojan might not get activated during the chip verification using logical testing or physical measurements. In this work, we present a novel Trojan detection approach based on a technique known from (IC) failure analysis, capable of detecting virtually all classes of dormant Trojans. Using (LLSI), we show how supply voltage modulations can awaken inactive Trojans, making them detectable using laser voltage imaging techniques. Therefore, our technique does not require triggering the Trojan. To support our claims, we present three case studies on 28 nm and 20 nm SRAM- and flash-based (FPGAs). We demonstrate how to detect with high confidence small changes in sequential and combinatorial logic as well as in the routing configuration of FPGAs in a non-invasive manner. Finally, we discuss the practical applicability of our approach on dormant analog Trojans in ASICs.

 

A universal circuit (UC) can be thought of as a programmable circuit that can simulate any circuit up to a certain size by specifying its secret configuration bits. UCs have been incorporated into various applications, such as private function evaluation (PFE). Recently, studies have attempted to formalize the concept of semiconductor intellectual property (IP) protection in the context of UCs. This is despite the observations made in theory and practice that, in reality, the adversary may obtain additional information about the secret when executing cryptographic protocols. This paper aims to answer the question of whether UCs leak information unintentionally, which can be leveraged by the adversary to disclose the configuration bits. In this regard, we propose the first photon emission analysis against UCs relying on computer vision-based approaches. We demonstrate that the adversary can utilize a cost-effective solution to take images to be processed by off-the-shelf algorithms to extract configuration bits. We examine the efficacy of our method in two scenarios: (1) the design is small enough to be captured in a single image during the attack phase, and (2) multiple images should be captured to launch the attack by deploying a divide-and-conquer strategy. To evaluate the effectiveness of our attack, we use metrics commonly applied in side-channel analysis, namely rank and success rate. By doing so, we show that our profiled photon emission analysis achieves a success rate of 1 by employing a few templates (concretely, only 18 images were used as templates).

 

Physical attacks can compromise the security of cryptographic devices. Depending on the attack’s requirements, adversaries might need to (i) place probes in the proximity of the integrated circuits (ICs) package, (ii) create physical connections between their probes/wires and the system’s PCB, or (iii) physically tamper with the PCB’s components, chip’s package, or substitute the entire PCB to prepare the device for the attack. While tamper-proof enclosures prevent and detect physical access to the system, their high manufacturing cost and incompatibility with legacy systems make them unattractive for many low-cost scenarios. In this paper, inspired by methods known from the field of power integrity analysis, we demonstrate how the impedance characterization of the system’s power distribution network (PDN) using on-chip circuit-based network analyzers can detect various classes of tamper events. We explain how these embedded network analyzers, without any modifications to the system, can be deployed on FPGAs to extract the frequency response of the PDN. The analysis of these frequency responses reveals different classes of tamper events from board to chip level. To validate our claims, we run an embedded network analyzer on FPGAs of a family of commercial development kits and perform extensive measurements for various classes of PCB and IC package tampering required for conducting different side-channel or fault attacks. Using the Wasserstein Distance as a statistical metric, we further show that we can confidently detect tamper events. Our results, interestingly, show that even environment-level tampering activities, such as the proximity of contactless EM probes to the IC package or slightly polished IC package, can be detected using on-chip impedance sensing.