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In recent years, the concentration of precious metals and hazardous pollutants in discarded consumer-grade computer enclosures has increased significantly, coinciding with e-waste generation in Asia reaching approximately 30 million tons annually. However, the high cost and low efficiency of manual disassembly present substantial obstacles to the effective recycling of such enclosures. Robotic disassembly has emerged as a promising alternative. To enable accurate acquisition of three-dimensional (3D) geometric data for robotic operations, we propose a 3D measurement method based on multi-color high dynamic range imaging. This method employs a seven-color illumination strategy and exploits the spectral response characteristics of a color camera to different wavelengths, effectively mitigating the reconstruction errors caused by overexposure on highly reflective surfaces—an issue common in traditional techniques. The proposed approach provides complete and reliable 3D morphological information to support robotic arm manipulation. Experimental results confirm that the method accurately captures the 3D profiles of reflective components such as CPUs and motherboards. Moreover, validation across computer enclosures of different brands and form factors demonstrates the method’s robustness and practical applicability in a wide range of e-waste disassembly scenarios.