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We experimentally demonstrated slow wave enhanced phase and spectral sensitivity in asymmetric Michelson interferometer sensors with a phase sensitivity 277,750 rad/RIU-cm and theoretical phase sensitivity as high as 461,810 rad/RIU-cm. In the context of low-cost chip integrated photonic packaged sensors, in this paper we will experimentally demonstrate a method for active tuning of interferometer fringes using phase change materials that will potentially overcome fabrication induced variation of interference fringe wavelengths, thus allowing sensor chip packaging with a fixed wavelength laser and available integrated photodetectors. 

High quality graphene can efficiently be grown on large surface areas of copper foil through chemical vapor deposition (CVD). To transfer CVD graphene onto a substrate for use in nanoscale photonic devices a process called electrochemical bubble delamination is utilized. During the delamination and transfer procedure the CVD graphene is at its most susceptible. Therefore, the incentive to develop a minimal-contact and replicable process is high. The use of a mechanical stage controlled by an actuator is a promising method of avoiding significant mechanical defects like folding or tearing and is capable of ensuring the film is delaminated at the right speed and from bottom to top. The quality of the transferred graphene is varied with regions of high-quality graphene up to 80x80µm while the typical transfer region has a large presence of gaps, cracks, and PMMA residues. It is evident that extending the mechanical assistance to other parts of the transfer process may be valuable, however, the occurrence of mechanical and chemical defects in the transferred graphene is still a limiting factor in the use of electrochemical bubble delamination.