Due to their lower pressure drop, impinging cold-plates are preferred over parallel flow cold-plates when there is no strict space limitation (i.e. when flow can enter perpendicular to the electronic board). Splitting the flow into two branches cuts the flow rate and path in half, which leads to lower pressure drop through the channels. A groove is used to direct the flow exiting the diffuser into the channels. The number of the geometric design parameters of the cold-plate will vary depending on the shape of the groove. In this research, the response surface method (RSM) was used to optimization the fin geometry of an impinging cold-plate with a trapezoidal cross section groove. The cold plate is used for warm water cooling of electronics. Three fin parameters (thickness, height, and gap) and three groove parameters were optimized to reach minimum values for hydraulic and thermal resistances at fixed values of coolant inlet temperature, coolant flow rate, and electronic chip power.
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Geometric Optimization on an Impinging Cold-Plate with a Trapezoidal Groove Used for Warm Water Cooling
Due to their lower pressure drop, impinging cold-plates are preferred over parallel flow cold-plates when there is no strict space limitation (i.e. when flow can enter perpendicular to the electronic board). Splitting the flow into two branches cuts the flow rate and path in half, which leads to lower pressure drop through the channels. A groove is used to direct the flow exiting the diffuser into the channels. The number of the geometric design parameters of the cold-plate will vary depending on the shape of the groove. In this research, the response surface method (RSM) was used to optimization the fin geometry of an impinging cold-plate with a trapezoidal cross section groove. The cold plate is used for warm water cooling of electronics. Three fin parameters (thickness, height, and gap) and three groove parameters were optimized to reach minimum values for hydraulic and thermal resistances at fixed values of coolant inlet temperature, coolant flow rate, and electronic chip power.
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- Award ID(s):
- 1738793
- NSF-PAR ID:
- 10064553
- Date Published:
- Journal Name:
- ITHERM
- ISSN:
- 1936-3958
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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