Abstract
3D printing of functional materials and devices is an emerging technology which may facilitate a higher degree of freedom in the fabrication of electronic devices in terms of material selection, 3D device form factor, morphology of target surfaces, and autonomy. This chapter discusses 3D printed electronics from the perspective of ink properties and device fabrication, including light-emitting diodes, tactile sensors and wireless powering. In combination with the progress in 3D structured light scanning, advances in computer vision, and commercial trends toward miniaturization, the prospect of autonomous, compact and portable 3D printers for electronic materials is discussed. Because the performance of 3D printed electronics is sensitively influenced by the homogeneity of printed layers, an understanding of fluid mechanics may enhance the quality of the printing and thus the performance of the resulting devices. Lastly, in order to create conformal contact between 3D printed electronics and the human body, an understanding of interfacial mechanics for 3D printed devices is suggested.
more »
« less
3D Printed Polymer Photodetectors
Extrusion‐based 3D printing, an emerging technology, has been previously used in the comprehensive fabrication of light‐emitting diodes using various functional inks, without cleanrooms or conventional microfabrication techniques. Here, polymer‐based photodetectors exhibiting high performance are fully 3D printed and thoroughly characterized. A semiconducting polymer ink is printed and optimized for the active layer of the photodetector, achieving an external quantum efficiency of 25.3%, which is comparable to that of microfabricated counterparts and yet created solely via a one‐pot custom built 3D‐printing tool housed under ambient conditions. The devices are integrated into image sensing arrays with high sensitivity and wide field of view, by 3D printing interconnected photodetectors directly on flexible substrates and hemispherical surfaces. This approach is further extended to create integrated multifunctional devices consisting of optically coupled photodetectors and light‐emitting diodes, demonstrating for the first time the multifunctional integration of multiple semiconducting device types which are fully 3D printed on a single platform. The 3D‐printed optoelectronic devices are made without conventional microfabrication facilities, allowing for flexibility in the design and manufacturing of next‐generation wearable and 3D‐structured optoelectronics, and validating the potential of 3D printing to achieve high‐performance integrated active electronic materials and devices.
more » « less- PAR ID:
- 10073616
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials
- Volume:
- 30
- Issue:
- 40
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Flame-retardant and thermal management structures have attracted great attention due to the requirement of high-temperature exposure in industrial, aerospace, and thermal power fields, but the development of protective fire-retardant structures with complex shapes to fit arbitrary surfaces is still challenging. Herein, we reported a rotation-blade casting-assisted 3D printing process to fabricate nacre-inspired structures with exceptional mechanical and flame-retardant properties, and the related fundamental mechanisms are studied. 3-(Trimethoxysilyl)propyl methacrylate (TMSPMA) modified boron nitride nanoplatelets (BNs) were aligned by rotation-blade casting during the 3D printing process to build the “brick and mortar” architecture. The 3D printed structures are more lightweight, while having higher fracture toughness than the natural nacre, which is attributed to the crack deflection, aligned BN (a-BNs) bridging, and pull-outs reinforced structures by the covalent bonding between TMSPMA grafted a-BNs and polymer matrix. Thermal conductivity is enhanced by 25.5 times compared with pure polymer and 5.8 times of anisotropy due to the interconnection of a-BNs. 3D printed heat-exchange structures with vertically aligned BNs in complex shapes were demonstrated for efficient thermal control of high-power light-emitting diodes. 3D printed helmet and armor with a-BNs show exceptional mechanical and fire-retardant properties, demonstrating integrated mechanical and thermal protection.more » « less
-
more » « less
Abstract Recent developments in stretchable electronics hold promise to advance wearable technologies for health monitoring. Emerging techniques allow soft materials to serve as substrates and packaging for electronics, enabling devices to comply with and conform to the body, unlike conventional rigid electronics. However, few stretchable electronic devices achieve the high integration densities that are possible using conventional substrates, such as printed rigid or flexible circuit boards. Here, a new manufacturing method is presented for wearable soft health monitoring devices with high integration densities. It is shown how to fabricate soft electronics on rigid carrier substrates using microfabrication techniques in tandem with strain relief features. Together, these make it possible to integrate a large variety of surface mount components in complex stretchable circuits on thin polymer substrates. The method is largely compatible with existing industrial manufacturing processes. The promise of these methods is demonstrated by realizing skin‐interfaced devices for multimodal physiological data capture via multiwavelength optoelectronic sensor arrays comprised of light emitting diodes and phototransistors. The devices provide high signal‐to‐noise ratio measurements of peripheral hemodynamics, illustrating the promise of soft electronics for wearable health monitoring applications.
-
more » « less
Abstract High-performance lightweight architectures, such as metallic microlattices with excellent mechanical properties have been 3D printed, but they do not possess shape memory effect (SME), limiting their usages for advanced engineering structures, such as serving as a core in multifunctional lightweight sandwich structures. 3D printable self-healing shape memory polymer (SMP) microlattices could be a solution. However, existing 3D printable thermoset SMPs are limited to either low strength, poor stress memory, or non-recyclability. To address this issue, a new thermoset polymer, integrated with high strength, high recovery stress, perfect shape recovery, good recyclability, and 3D printability using direct light printing, has been developed in this study. Lightweight microlattices with various unit cells and length scales were printed and tested. The results show that the cubic microlattice has mechanical strength comparable to or even greater than that of metallic microlattices, good SME, decent recovery stress, and recyclability, making it the first multifunctional lightweight architecture (MLA) for potential multifunctional lightweight load carrying structural applications.
-
more » « less
Abstract Semiconducting polymers are promising materials for manufacturing optoelectronic devices, such as large‐area solar cells or small light‐emitting diodes, through the use of printing technologies. In their oxidized form, π‐conjugated polymers become good electrical conductors and their optical absorption shifts to the infrared region. It is demonstrated that conducting polymers can be integrated in bolometers for IR detection. A bolometer is a thermally isolated thin device that absorbs IR radiation and translates a temperature change into a change in electrical resistance. While commercial bolometers are usually made of complex architectures comprising several materials (that is, an IR absorbing layer, a conducting layer, and a thermally insulating layer), the first polymer bolometer is demonstrated with a freestanding layer of poly(3,4‐ethylene‐dioxythiophene) having high IR absorption, low thermal conductivity, and good thermistor action in one single layer. The solution processability of conducting polymers, their compatibility with high‐resolution printing technologies, and their unique combination of optoelectronic properties can lead to a breakthrough for low‐cost uncooled IR cameras, which are in high demand for security and safety applications.
