Contact engineering on monolayer layer (ML) semiconducting transition metal dichalcogenides (TMDs) is considered the most challenging problem towards using these materials as a transistor channel in future advanced technology nodes. The typically observed strong Femi level pinning induced in part by the reaction of the source/drain contact metal and the ML TMD frequently results in a large Schottky barrier height, which limits the electrical performance of ML TMD field-effect transistors (FETs). However, at a microscopic level, little is known about how interface defects or reaction sites impact the electrical performance of ML TMD FETs. In this work, we have performed statistically meaningful electrical measurements on at least 120 FETs combined with careful surface analysis to unveil contact resistance dependencies on the interface chemistry. In particular, we achieved a low contact resistance for ML MoS2 FETs with ultra-high vacuum (UHV, 3×10-11 mbar) deposited Ni contacts, ~500 ohm·μm, which is 5 times lower than the contact resistance achieved when deposited at high vacuum (HV, 3×10-6 mbar) conditions. These electrical results strongly correlate with our surface analysis observations. X-ray photoelectron spectroscopy (XPS) revealed significant bonding species between Ni and MoS2 under UHV conditions compared to HV. We also studied the Bi/MoS2 interface under UHV and HV deposition conditions. Different from the case of Ni, we do not observe a difference in contact resistance or interface chemistry between contacts deposited under UHV and HV. Finally, this article also explores the thermal stability and reliability of the two contact metals employed here.
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1T Phase as an Efficient Hole Injection Layer to TMDs Transistors: A Universal Approach to Achieve p-type Contacts
Recently, the fabricated MoS2 field effect transistors (FETs) with 1T-MoS2 electrodes exhibit excellent performance with rather low contact resistance, as compared with those with metals deposited directly on 2H-MoS2 (Kappera et al 2014 Nat. Mater. 13 1128), but the reason for that remains elusive. By means of density functional theory calculations, we investigated the carrier injection at the 1T/2H MoS2 interface and found that although the Schottky barrier height (SBH) values of 1T/2H MoS2 interfaces can be tuned by controlling the stacking patterns, the p-type SBH values of 1T/2H MoS2 interfaces with different stackings are lower than their corresponding n-type SBH values, which demonstrated that the metallic 1T phase can be used as an efficient hole injection layer for 2H-MoS2. In addition, as compared to the n-type Au/MoS2 and Pd/MoS2 contacts, the p-type SBH values of 1T/2H MoS2 interfaces are much lower, which stem from the efficient hole injection between 1T-MoS2 and 2H-MoS2. This can explain the low contact resistance in the MoS2 FETs with 1T-MoS2 electrodes. Notably, the SBH values can be effectively modulated by an external electric field, and a significantly low p-type SBH value can be achieved under an appropriate electric field. We also demonstrated that this approach is also valid for WS2, WSe2 and MoSe2 systems, which indicates that the method can most likely be extended to other TMDs, and thus may open new promising avenues of contact engineering in these materials.
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- Award ID(s):
- 1736093
- PAR ID:
- 10076513
- Date Published:
- Journal Name:
- 2D materials
- Volume:
- 5
- ISSN:
- 2053-1583
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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