Modeling of THz Chip-to-Chip Wireless Channels in Metal Enclosures

Zajic, Alenka; Juyal, Prateek

Abstract The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/output (I/O) in such systems. In a co-packaged design, the scaling of bandwidth, cost, and energy will be governed by the number of optical I/O channels and the data rate per channel. While optical communication provide an opportunity to exploit wavelength division multiplexing (WDM) to scale data rate, the limited 127 µm pitch of V-groove based single mode fiber arrays and the use of active alignment and bonding for their packaging present challenges to scaling the number of optical channels. Flip-chip optical couplers which allow for low loss, broadband operation and automated passive assembly represent a solution for continued scaling. In this paper, we propose a novel scheme to vertically couple between silicon based waveguides on separate chips using graded index (GRIN) couplers in combination with an evanescent coupler. Simulation results using a 3D Finite-Difference Time-Domain (FDTD) solver are presented, demonstrating coupling losses as low as 0.35 dB for a chip-to-chip gap of 11 µm; 1-dB vertical and lateral alignment tolerances of approximately 2.45 µm and ± 2.66 µm, respectively; and a possible 1-dB bandwidth of greater than 1500 nm. These results demonstrate the potential of our coupler as a universal interface in future co-packaged optics systems.

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