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1. An Experimental Analysis of Hot Aisle Containment Systems

   https://doi.org/10.1109/ITHERM.2018.8419555  

   Khalili, Sadegh; Alissa, Husam; Desu, Anuroop; Sammakia, Bahgat; Ghose, Kanad (May 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm))

   In recent years, various airflow containment systems have been deployed in data centers to improve the cooling efficiency by minimizing the mixing of hot and cold air streams. The goal of this study is the experimental investigation of passive and active hot aisle containment (HAC) systems. Also investigated, will be the dynamic interaction between HAC and information technology equipment (ITE). In addition, various provisioning levels of HAC are studied. In this study, a chimney exhaust rack (CER) is considered as the HAC system. The rack is populated by 22 commercial 2-RU servers and one network switch. Four scenarios with and without the presence of cold and hot aisle containments are investigated and compared. The transient pressure build-up inside the rack, servers' fan speed, inlet air temperatures (IAT), IT power consumption, and CPU temperatures are monitored and operating data recorded. In addition, IAT of selected servers is measured using external temperature sensors and compared with data available via the Intelligent Platform Management Interface (IPMI). To the best of authors' knowledge, this is the first experimental study in which a HAC system is analyzed using commercial ITE in a white space. It is observed that presence of backpressure can lead to a false high IPMI IAT reading. Consequently, a cascade rise in servers' fan speed is observed, which increases the backpressure and worsen the situation. As a result, the thermal performance of ITE and power consumption of the rack are affected. Furthermore, it is shown that the backpressure can affect the accuracy of common data center efficiency metrics. 

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2. Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

   https://doi.org/10.1115/IPACK2017-74016  

   Sahini, Manasa; Agonafer, Dereje; Pandiyan, Vijayalan (August 2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems)

   Data centers house a variety of compute, storage, network IT hardware where equipment reliability is of utmost importance. Heat generated by the IT equipment can substantially reduce its service life if Tjmax, maximum temperature that the microelectronic device tolerates to guarantee reliable operation, is exceeded. Hence, data center rooms are bound to maintain continuous conditioning of the cooling medium becoming large energy consumers. The objective of this work is to introduce and evaluate a new end-of-aisle cooling design which consists of three cooling configurations. The key objectives of close-coupled cooling are to enable a controlled cooling of the IT equipment, flexible as well as modular design, and containment of hot air exhaust from the cold air. The thermal performance of the proposed solution is evaluated using CFD modeling. A computational model of a small size data center room has been developed. Larger axial fans are selected and placed at rack-level which constitute the rack-fan wall design. The model consists of 10 electronic racks each dissipating a heat load of 8kw. The room is modeled to be hot aisle containment i.e. the hot air exhaust exiting for each row is contained and directed within a specific volume. Each rack has passive IT with no server fans and the servers are cooled by means of rack fan wall. The cold aisle is separated with hot aisle by means of banks of heat exchangers placed on the either sides of the aisle containment. Based on the placement of rack fans, the design is divided to three sub designs — case 1: passive heat exchangers with rack fan walls; case 2: active heat exchangers (HXs coupled with fans) with rack fan walls; case 3: active heat exchangers (hxs coupled with fans) with no rack fans. The cooling performance is calculated based on the thermal and flow parameters obtained for all three configurations. The computational data obtained has shown that the case 1 is used only for lower system resistance IT. However, case 2 and Case 3 can handle denser IT systems. Case 3 is the design that can consume lower fan energy as well as handle denser IT systems. The paper also discusses the cooling behavior of each type of design. 

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3. Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis

   https://doi.org/https://doi.org/10.4071/imaps.528113  

   Sahini, M; Agonafer, D (January 2018, Journal of microelectronics and electronic packaging)

   The objective of this work is to introduce and evaluate a new end-of-aisle cooling design which consists of three cooling configurations. The key objectives of close-coupled cooling are to enable controlled cooling of information technology (IT) equipment, flexible and modular design, and the containment of hot air exhaust from the cold air. The thermal performance of the proposed solution is evaluated using computational fluid dynamics modeling. A computational model of a small size data center room has been developed. The room is modeled to be a hot aisle containment setup, i.e., the hot air exhaust exiting for each row is contained and directed within a specific volume. The cold aisle is separated from the hot aisle by means of banks of heat exchangers (HXs) placed on either side of the containment aisle. Based on the placement of rack fans, the design is divided into three sub-designs—Case 1: passive HXs with rack fan walls; Case 2: active HXs (coupled with fans) with rack fan walls; Case 3: active HXs (coupled with fans) with no rack fans. The cooling performance is calculated based on the thermal and flow parameters obtained for all three configurations. The computational data obtained has shown that the Case 1 is used only for lower system resistance IT. However, Cases 2 and 3 can handle denser IT systems. Case 3 is the design that can consume lower fan energy and handle denser IT systems. The article also discusses the cooling behavior of each type of design under cooling failure conditions with Case 2 showing better cooling redundancy compared with other two cases. 

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4. Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

   https://doi.org/10.1115/IPACK2018-8334  

   Tradat, Mohammad; Sammakia, Bahgat; Alissa, Husam; Nemati, Kourosh (January 2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems)

   Given the vital rule of data center availability and since the inlet temperature of the IT equipment increase rapidly until reaching a certain threshold value after which IT starts throttling or shut down because of overheat during cooling system failure. Hence, it is especially important to understand failures and their effects. This study presented experimental investigation and analysis of a facility-level cooling system failure scenario in which chilled water interruption introduced to the data center. Quantitative instrumentation tools including wireless technology such as wireless temperature and pressure sensors were used to measure the discrete air inlet temperature and pressure differential though cold aisle enclosure, respectively. In addition, Intelligent Platform Management Interface (IPMI) and cooling system data during failure/recovery were reported. Furthermore, the IT equipment performance and response for opened and contained environments were simulated and compared. Finally, an experiment based analysis of the Ride Through Time (RTT) of servers during chilled water interruption of the cooling infrastructure presented as well. The results showed that for all three classes of servers tested during the cooling failure, CAC helped keep the server’s cooler for longer. The containment provided a barrier between the hot and cold air streams and caused slight negative pressure to build up, which allowed the servers to pull cold air from the underfloor plenum. In addition, the results show that the effect of CAC in containment solutions on the IT equipment performance and response could vary and depend on the server’s airflow, generation and hence types of servers deployed in cold aisle enclosure. Moreover, it was shown that when compared to the discrete sensors, the IPMI inlet temperature sensors underestimate the Ride Through Time (RTT) by 42% and 12% for the CAC and opened cases, respectively. 

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5. Airflow Management Using Active Air Dampers in Presence of a Dynamic Workload in Data Centers

   Khalili, S.; Mohsenian, G.; Desu, A.; Ghose, K.; Sammakia, B. (January 2019, SEMI-THERM 2019)

   The dynamic nature of today’s data centers requires active monitoring and holistic management of all aspects of the facility, from the applications to the air conditioning. The most significant aspect of implementing a dynamic data center is the requirement to actively monitor and manage the infrastructure assets. It is vital to ensure information technology (IT) equipment has access to sufficient air (provisioned) at a proper temperature to assure their optimal and continues operation. Hot air recirculation, elevated fan speed, and hot spots are known consequences of an under-provisioned cold aisle. On the other hand, over-provisioning a cold aisle can lead to a significant loss in energy due to bypass of cooling air and leakages. Besides, the number of active servers in an aisle may be varied by load balancers due to short or long-term IT load changes. This demonstrates the need for an active airflow management scheme that is able to respond to airflow demand in different aisles of a data center. In this study, remotely controllable air dampers are implemented to regulate airflow delivery to a cold aisle containment (CAC) during workload changes in a data center. The energy saving opportunities are investigated and practical considerations are discussed. 

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