We report the growth of nanoscale hafnium dioxide (HfO2) and zirconium dioxide (ZrO2) thin films using remote plasma-enhanced atomic layer deposition (PE-ALD), and the fabrication of complementary metal-oxide semiconductor (CMOS) integrated circuits using the HfO2 and ZrO2 thin films as the gate oxide. Tetrakis (dimethylamino) hafnium (Hf[N(CH3)2]4) and tetrakis (dimethylamino) zirconium (IV) (Zr[N(CH3)2]4) were used as the precursors, while O2 gas was used as the reactive gas. The PE-ALD-grown HfO2 and ZrO2 thin films were analyzed using X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and high-resolution transmission electron microscopy (HRTEM). The XPS measurements show that the ZrO2 film has the atomic concentrations of 34% Zr, 2% C, and 64% O while the HfO2 film has the atomic concentrations of 29% Hf, 11% C, and 60% O. The HRTEM and XRD measurements show both HfO2 and ZrO2 films have polycrystalline structures. n-channel and p-channel metal-oxide semiconductor field-effect transistors (nFETs and pFETs), CMOS inverters, and CMOS ring oscillators were fabricated to test the quality of the HfO2 and ZrO2 thin films as the gate oxide. Current-voltage (IV) curves, transfer characteristics, and oscillation waveforms were measured from the fabricated transistors, inverters, and oscillators, respectively. The experimental results measured from the HfO2 and ZrO2 thin films were compared.
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Electrical and chemical characterizations of hafnium (IV) oxide films for biological lab-on-a-chip devices
Many biological lab-on-a-chip applications require electrical and optical manipulation as well as detection of cells and biomolecules. This provides an intriguing challenge to design robust microdevices that resist adverse electrochemical side reactions yet achieve optical transparency. Physical isolation of biological samples from microelectrodes can prevent contamination, electrode fouling, and electrochemical byproducts; thus this manuscript explores hafnium oxide (HfO2) films - originating from traditional transistor applications – for suitability in electrokinetic microfluidic devices for biological applications. HfO2 films with deposition times of 6.5, 13, and 20 min were sputter deposited onto silicon and glass substrates. The structural, optical, and electrical properties of the HfO2 films were investigated using atomic force microscopy (AFM), X-ray diffraction, energy dispersive X-ray spectroscopy, Fourier transform infrared spectroscopy, ellipsometry, and capacitance voltage. Electric potential simulations of the HfO2 films and a biocompatibility study provided additional insights. Film grain size after corrosive Piranha treatment was observed via AFM. The crystalline structure investigated via X-ray diffraction revealed all films exhibited the (111) characteristic peak with thicker films exhibiting multiple peaks indicative of anisotropic structures. Energy dispersive X-ray spectroscopy via field emission scanning electron microscopy and Fourier transform infrared spectroscopy both corroborated the atomic ratio of the films as HfO2. Ellipsometry data from Si yielded thicknesses of 58, 127, and 239 nm and confirmed refractive index and extinction coefficients within the normal range for HfO2; glass data yielded unreliable thickness verifications due to film and substrate transparency. Capacitance-voltage results produced an average dielectric constant of 20.32, and the simulations showed that HfO2 dielectric characteristics were sufficient to electrically passivate planar microelectrodes. HfO2 biocompatibility was determined with human red blood cells by quantifying the hemolytic potential of the HfO2 films. Overall results support hafnium oxide as a viable passivation material for biological lab-on-a-chip applications.
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- Award ID(s):
- 1632678
- PAR ID:
- 10097227
- Date Published:
- Journal Name:
- Thin solid films
- Volume:
- 662
- ISSN:
- 0040-6090
- Page Range / eLocation ID:
- 60-69
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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