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Title: Power and Data Integrity in Monolithic 3D Integrated SIMON Core
Award ID(s):
1717306
NSF-PAR ID:
10119346
Author(s) / Creator(s):
;
Date Published:
Journal Name:
IEEE International Symposium on Circuits and Systems
Page Range / eLocation ID:
1 to 5
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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