Power and Data Integrity in Monolithic 3D Integrated SIMON Core
- Award ID(s):
- 1717306
- PAR ID:
- 10119346
- Date Published:
- Journal Name:
- IEEE International Symposium on Circuits and Systems
- Page Range / eLocation ID:
- 1 to 5
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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