The progress in the field of neural computation hinges on the use of hardware more efficient than the conventional microprocessors. Recent works have shown that mixed-signal integrated memristive circuits, especially their passive (0T1R) variety, may increase the neuromorphic network performance dramatically, leaving far behind their digital counterparts. The major obstacle, however, is immature memristor technology so that only limited functionality has been reported. Here we demonstrate operation of one-hidden layer perceptron classifier entirely in the mixed-signal integrated hardware, comprised of two passive 20 × 20 metal-oxide memristive crossbar arrays, board-integrated with discrete conventional components. The demonstrated network, whose hardware complexity is almost 10× higher as compared to previously reported functional classifier circuits based on passive memristive crossbars, achieves classification fidelity within 3% of that obtained in simulations, when using ex-situ training. The successful demonstration was facilitated by improvements in fabrication technology of memristors, specifically by lowering variations in their
Memristors with tunable resistance states are emerging building blocks of artificial neural networks. However, in situ learning on a large-scale multiple-layer memristor network has yet to be demonstrated because of challenges in device property engineering and circuit integration. Here we monolithically integrate hafnium oxide-based memristors with a foundry-made transistor array into a multiple-layer neural network. We experimentally demonstrate in situ learning capability and achieve competitive classification accuracy on a standard machine learning dataset, which further confirms that the training algorithm allows the network to adapt to hardware imperfections. Our simulation using the experimental parameters suggests that a larger network would further increase the classification accuracy. The memristor neural network is a promising hardware platform for artificial intelligence with high speed-energy efficiency.
more » « less- NSF-PAR ID:
- 10154341
- Publisher / Repository:
- Nature Publishing Group
- Date Published:
- Journal Name:
- Nature Communications
- Volume:
- 9
- Issue:
- 1
- ISSN:
- 2041-1723
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Abstract I–V characteristics. -
Abstract The superior density of passive analog-grade memristive crossbar circuits enables storing large neural network models directly on specialized neuromorphic chips to avoid costly off-chip communication. To ensure efficient use of such circuits in neuromorphic systems, memristor variations must be substantially lower than those of active memory devices. Here we report a 64 × 64 passive crossbar circuit with ~99% functional nonvolatile metal-oxide memristors. The fabrication technology is based on a foundry-compatible process with etch-down patterning and a low-temperature budget. The achieved <26% coefficient of variance in memristor switching voltages is sufficient for programming a 4K-pixel gray-scale pattern with a <4% relative tuning error on average. Analog properties are also successfully verified via experimental demonstration of a 64 × 10 vector-by-matrix multiplication with an average 1% relative conductance import accuracy to model the MNIST image classification by ex-situ trained single-layer perceptron, and modeling of a large-scale multilayer perceptron classifier based on more advanced conductance tuning algorithm.
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Network features found in the brain may help implement more efficient and robust neural networks. Spiking neural networks (SNNs) process spikes in the spatiotemporal domain and can offer better energy efficiency than deep neural networks. However, most SNN implementations rely on simple point neurons that neglect the rich neuronal and dendritic dynamics. Herein, a bio‐inspired columnar learning network (CLN) structure that employs feedforward, lateral, and feedback connections to make robust classification with sparse data is proposed. CLN is inspired by the mammalian neocortex, comprising cortical columns each containing multiple minicolumns formed by interacting pyramidal neurons. A column continuously processes spatiotemporal signals from its sensor, while learning spatial and temporal correlations between features in different regions of an object along with the sensor's movement through sensorimotor interaction. CLN can be implemented using memristor crossbars with a local learning rule, spiking timing‐dependent plasticity (STDP), which can be natively obtained in second‐order memristors. CLN allows inputs from multiple sensors to be simultaneously processed by different columns, resulting in higher classification accuracy and better noise tolerance. Analysis of networks implemented on memristor crossbars shows that the system can operate at very low power and high throughput, with high accuracy and robustness to noise.
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Abstract This work reports on the hardware implementation of analog dot-product operation on arrays of 2D hexagonal boron nitride (h-BN) memristors. This extends beyond previous work that studied isolated device characteristics towards the application of analog neural network accelerators based on 2D memristor arrays. The wafer-level fabrication of the memristor arrays is enabled by large-area transfer of CVD-grown few-layer (8 layers) h-BN films. Individual devices achieve an on/off ratio of >10, low voltage operation (~0.5 Vset/Vreset), good endurance (>6,000 programming steps), and good retention (>104 s). The dot-product operation shows excellent linearity and repeatability, with low read energy consumption (~200 aJ to 20 fJ per operation), with minimal error and deviation over various measurement cycles. Moreover, we present the implementation of a stochastic logistic regression algorithm in 2D h-BN memristor hardware for the classification of noisy images. The promising resistive switching characteristics, performance of dot-product computation, and successful demonstration of logistic regression in h-BN memristors signify an important step towards the integration of 2D materials for next-generation neuromorphic computing systems.more » « less
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By mimicking biomimetic synaptic processes, the success of artificial intelligence (AI) has been astounding with various applications such as driving automation, big data analysis, and natural-language processing.[1-4] Due to a large quantity of data transmission between the separated memory unit and the logic unit, the classical computing system with von Neumann architecture consumes excessive energy and has a significant processing delay.[5] Furthermore, the speed difference between the two units also causes extra delay, which is referred to as the memory wall.[6, 7] To keep pace with the rapid growth of AI applications, enhanced hardware systems that particularly feature an energy-efficient and high-speed hardware system need to be secured. The novel neuromorphic computing system, an in-memory architecture with low power consumption, has been suggested as an alternative to the conventional system. Memristors with analog-type resistive switching behavior are a promising candidate for implementing the neuromorphic computing system since the devices can modulate the conductance with cycles that act as synaptic weights to process input signals and store information.[8, 9]
The memristor has sparked tremendous interest due to its simple two-terminal structure, including top electrode (TE), bottom electrode (BE), and an intermediate resistive switching (RS) layer. Many oxide materials, including HfO2, Ta2O5, and IGZO, have extensively been studied as an RS layer of memristors. Silicon dioxide (SiO2) features 3D structural conformity with the conventional CMOS technology and high wafer-scale homogeneity, which has benefited modern microelectronic devices as dielectric and/or passivation layers. Therefore, the use of SiO2as a memristor RS layer for neuromorphic computing is expected to be compatible with current Si technology with minimal processing and material-related complexities.
In this work, we proposed SiO2-based memristor and investigated switching behaviors metallized with different reduction potentials by applying pure Cu and Ag, and their alloys with varied ratios. Heavily doped p-type silicon was chosen as BE in order to exclude any effects of the BE ions on the memristor performance. We previously reported that the selection of TE is crucial for achieving a high memory window and stable switching performance. According to the study which compares the roles of Cu (switching stabilizer) and Ag (large switching window performer) TEs for oxide memristors, we have selected the TE materials and their alloys to engineer the SiO2-based memristor characteristics. The Ag TE leads to a larger memory window of the SiO2memristor, but the device shows relatively large variation and less reliability. On the other hand, the Cu TE device presents uniform gradual switching behavior which is in line with our previous report that Cu can be served as a stabilizer, but with small on/off ratio.[9] These distinct performances with Cu and Ag metallization leads us to utilize a Cu/Ag alloy as the TE. Various compositions of Cu/Ag were examined for the optimization of the memristor TEs. With a Cu/Ag alloying TE with optimized ratio, our SiO2based memristor demonstrates uniform switching behavior and memory window for analog switching applications. Also, it shows ideal potentiation and depression synaptic behavior under the positive/negative spikes (pulse train).
In conclusion, the SiO2memristors with different metallization were established. To tune the property of RS layer, the sputtering conditions of RS were varied. To investigate the influence of TE selections on switching performance of memristor, we integrated Cu, Ag and Cu/Ag alloy as TEs and compared the switch characteristics. Our encouraging results clearly demonstrate that SiO2with Cu/Ag is a promising memristor device with synaptic switching behavior in neuromorphic computing applications.
Acknowledgement This work was supported by the U.S. National Science Foundation (NSF) Award No. ECCS-1931088. S.L. and H.W.S. acknowledge the support from the Improvement of Measurement Standards and Technology for Mechanical Metrology (Grant No. 22011044) by KRISS.
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