Industry trends are moving toward increasing use of chiplets as a replacement for monolithic fabrication in many modern chips. Each chiplet is a separately-produced silicon die, and a system-on-chip (SoC) is created by packaging the chiplets together on a silicon interposer or bridge. Chiplets enable IP reuse, heterogeneousintegration, and better ability to leverage cost-appropriate process nodes. Yet, creating systems from separately produced components also brings security risks to consider, such as the possibility of die swapping, or susceptibility to interposer probing or tampering. In a zero-trust security posture, a chiplet should not blindly assume it is operating in a friendly environment.In this paper we propose a delay-based PUF for chiplets to verify system integrity. Our technique allows a single chiplet to initiate a protocol with its neighbors to measure unique variations in the propagation delays of incoming signals as part of an integrity check. We prototype our design on Xilinx Ultrascale+ FPGAs, which are constructed as multi-die systems on a silicon interposer, and which also emulate the general features of other industrial chiplet interfaces. We perform experiments on, and compare data from, dozens of Ultrascale+ FPGAs by making use of Amazon’s Elastic Compute Cloud (EC2) F1 instances as a testing platform. The PUF cells are shown to reject clock and temperature variation as common mode, and each cell produces approximately 5 ps of unique delay variation. For a design with 144 PUF cells, we measure the mean within-class and between-class distances to be 68.3 ps and 847.7 ps, respectively. The smallest between-class distance of 686.0 ps exceeds the largest within-class distance of 124.0 ps by more than 5x under nominal conditions, and the PUF is shown to be resilient to environmental changes. Our findings indicate the PUF can be used for authentication, and is potentially sensitive enough to detect picosecond-scale timing changes due to tampering.
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Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools
Chiplet integration using 2.5D packaging is gaining popularity nowadays which enables several interesting features like heterogeneous integration and drop-in design method. In the traditional die-by-die approach of designing a 2.5D system, each chiplet is designed independently without any knowledge of the package RDLs. In this paper, we propose a Chip-Package Co-Design flow for implementing 2.5D systems using existing commercial chip design tools. Our flow encompasses 2.5D-aware partitioning suitable for SoC design, Chip-Package Floorplanning, and post-design analysis and verification of the entire 2.5D system. We also designed our own package planners to route RDL layers on top of chiplet layers. We use an ARM Cortex-M0 SoC system to illustrate our flow and compare analysis results with a monolithic 2D implementation of the same system. We also compare two different 2.5D implementations of the same SoC system following the drop-in approach. Alongside the traditional die-by-die approach, our holistic flow enables design efficiency and flexibility with accurate cross-boundary parasitic extraction and design verification.
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- Award ID(s):
- 1755981
- NSF-PAR ID:
- 10166521
- Date Published:
- Journal Name:
- 2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)
- Page Range / eLocation ID:
- 351 to 356
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1109/ASP-DAC47756.2020.9045734
