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Title: Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools
Chiplet integration using 2.5D packaging is gaining popularity nowadays which enables several interesting features like heterogeneous integration and drop-in design method. In the traditional die-by-die approach of designing a 2.5D system, each chiplet is designed independently without any knowledge of the package RDLs. In this paper, we propose a Chip-Package Co-Design flow for implementing 2.5D systems using existing commercial chip design tools. Our flow encompasses 2.5D-aware partitioning suitable for SoC design, Chip-Package Floorplanning, and post-design analysis and verification of the entire 2.5D system. We also designed our own package planners to route RDL layers on top of chiplet layers. We use an ARM Cortex-M0 SoC system to illustrate our flow and compare analysis results with a monolithic 2D implementation of the same system. We also compare two different 2.5D implementations of the same SoC system following the drop-in approach. Alongside the traditional die-by-die approach, our holistic flow enables design efficiency and flexibility with accurate cross-boundary parasitic extraction and design verification.
Award ID(s):
Publication Date:
Journal Name:
2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)
Page Range or eLocation-ID:
351 to 356
Sponsoring Org:
National Science Foundation
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