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Title: Diffusion break-aware leakage power optimization and detailed placement in sub-10nm VLSI
Award ID(s):
1730158
PAR ID:
10171013
Author(s) / Creator(s):
; ; ;
Date Published:
Journal Name:
Proceedings of the Asia and South Pacific Design Automation Conference
Page Range / eLocation ID:
550 to 556
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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