Fiber-Interconnect Silicon Chiplet Technology for Self-Aligned Fiber-to-Chip Assembly
- Award ID(s):
- 1810081
- PAR ID:
- 10189143
- Date Published:
- Journal Name:
- IEEE Photonics Technology Letters
- Volume:
- 31
- Issue:
- 16
- ISSN:
- 1041-1135
- Page Range / eLocation ID:
- 1311 to 1314
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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