Zhao, Biyao, Liang, Shuang, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Ruehli, Albert, Archambeault, Bruce, Fan, Jun, and Drewniak, James. Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs. Retrieved from https://par.nsf.gov/biblio/10213241. IEEE Electromagnetic Compatibility Magazine 9.3 Web. doi:10.1109/MEMC.2020.9241560.

Zhao, Biyao, Liang, Shuang, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Ruehli, Albert, Archambeault, Bruce, Fan, Jun, & Drewniak, James. Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs. IEEE Electromagnetic Compatibility Magazine, 9 (3). Retrieved from https://par.nsf.gov/biblio/10213241. https://doi.org/10.1109/MEMC.2020.9241560

Zhao, Biyao, Liang, Shuang, Connor, Samuel, Cocchini, Matteo, Achkir, Brice, Ruehli, Albert, Archambeault, Bruce, Fan, Jun, and Drewniak, James. "Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs". IEEE Electromagnetic Compatibility Magazine 9 (3). Country unknown/Code not available. https://doi.org/10.1109/MEMC.2020.9241560. https://par.nsf.gov/biblio/10213241.

@article{osti_10213241,
place = {Country unknown/Code not available}, title = {Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs}, url = {https://par.nsf.gov/biblio/10213241}, DOI = {10.1109/MEMC.2020.9241560}, abstractNote = {}, journal = {IEEE Electromagnetic Compatibility Magazine}, volume = {9}, number = {3}, author = {Zhao, Biyao and Liang, Shuang and Connor, Samuel and Cocchini, Matteo and Achkir, Brice and Ruehli, Albert and Archambeault, Bruce and Fan, Jun and Drewniak, James}, editor = {null} }