Sondhi, Kartik, Avuthu, Sai Guruva, Richstein, Jörg, Fan, Z Hugh, and Nishida, Toshikazu. Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics. Retrieved from https://par.nsf.gov/biblio/10222128. Flexible and Printed Electronics 6.2 Web. doi:10.1088/2058-8585/abeb58.

Sondhi, Kartik, Avuthu, Sai Guruva, Richstein, Jörg, Fan, Z Hugh, & Nishida, Toshikazu. Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics. Flexible and Printed Electronics, 6 (2). Retrieved from https://par.nsf.gov/biblio/10222128. https://doi.org/10.1088/2058-8585/abeb58

Sondhi, Kartik, Avuthu, Sai Guruva, Richstein, Jörg, Fan, Z Hugh, and Nishida, Toshikazu. "Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics". Flexible and Printed Electronics 6 (2). Country unknown/Code not available. https://doi.org/10.1088/2058-8585/abeb58. https://par.nsf.gov/biblio/10222128.

@article{osti_10222128,
place = {Country unknown/Code not available}, title = {Fabrication and non-destructive characterization of through-plastic-via (TPV) in flexible hybrid electronics}, url = {https://par.nsf.gov/biblio/10222128}, DOI = {10.1088/2058-8585/abeb58}, abstractNote = {}, journal = {Flexible and Printed Electronics}, volume = {6}, number = {2}, author = {Sondhi, Kartik and Avuthu, Sai Guruva and Richstein, Jörg and Fan, Z Hugh and Nishida, Toshikazu}, editor = {null} }