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Title: Imaging sub-surface defects in power electronic modules using shear-force microscopy
Award ID(s):
1738723
PAR ID:
10227713
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Page Range / eLocation ID:
1396 to 1401
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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