GridNet: Fast date-driven EM-induced IR drop prediction and localized fixing for on-chip power grid networks
Electromigration (EM) is a major failure effect for on-chip power grid networks of deep submicron VLSI circuits. EM degradation of metal grid lines can lead to excessive voltage drops (IR drops) before the target lifetime. In this paper, we propose a fast data-driven EM-induced IR drop analysis framework for power grid networks, named {\it GridNet}, based on the conditional generative adversarial networks (CGAN). It aims to accelerate the incremental full-chip EM-induced IR drop analysis, as well as IR drop violation fixing during the power grid design and optimization. More importantly, {\it GridNet} can naturally leverage the differentiable feature of deep neural networks (DNN) to {\it obtain the sensitivity information of node voltage with respect to the wire resistance (or width) with marginal cost}. {\it GridNet} treats continuous time and the given electrical features as input conditions, and the EM-induced time-varying voltage of power grid networks as the conditional outputs, which are represented as data series images. We show that {\it GridNet} is able to learn the temporal dynamics of the aging process in continuous time domain. Besides, we can take advantage of the sensitivity information provided by {\it GridNet} to perform efficient localized IR drop violation fixing in the late stage design and optimization. Numerical results on 36000 synthesized power grid network samples demonstrate that the new method can lead to $10^5\times$ more »
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10279542
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Proc. IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’20),
5. Electromigration (EM) analysis for complicated interconnects requires the solving of partial differential equations, which is expensive. In this paper, we propose a fast transient hydrostatic stress analysis for EM failure assessment for multi-segment interconnects using generative adversarial networks (GANs). Our work is inspired by the image synthesis and feature of generative deep neural networks. The stress evaluation of multi-segment interconnects, modeled by partial differential equations, can be viewed as time-varying 2D-images-to-image problem where the input is the multi-segment interconnects topology with current densities and the output is the EM stress distribution in those wire segments at the given aging time. We show that the conditional GAN can be exploited to attend the temporal dynamics for modeling the time-varying dynamic systems like stress evolution over time. The resulting algorithm, called {\it EM-GAN}, can quickly give accurate stress distribution of a general multi-segment wire tree for a given aging time, which is important for full-chip fast EM failure assessment. Our experimental results show that the EM-GAN shows 6.6\% averaged error compared to COMSOL simulation results with orders of magnitude speedup. It also delivers $8.3 \times$ speedup over state-of-the-art analytic based EM analysis solver.