Soft, elastically deformable composites with liquid metal (LM) droplets can enable new generations of soft electronics, robotics, and reconfigurable structures. However, techniques to control local composite microstructure, which ultimately governs material properties and performance, is lacking. Here a direct ink writing technique is developed to program the LM microstructure (i.e., shape, orientation, and connectivity) on demand throughout elastomer composites. In contrast to inks with rigid particles that have fixed shape and size, it is shown that emulsion inks with LM fillers enable in situ control of microstructure. This enables filaments, films, and 3D structures with unique LM microstructures that are generated on demand and locked in during printing. This includes smooth and discrete transitions from spherical to needle‐like droplets, curvilinear microstructures, geometrically complex embedded inclusion patterns, and connected LM networks. The printed materials are soft (modulus < 200 kPa), highly deformable (>600 % strain), and can be made locally insulating or electrically conductive using a single ink by controlling the process conditions. These capabilities are demonstrated by embedding elongated LM droplets in a soft heat sink, which rapidly dissipates heat from high‐power LEDs. These programmable microstructures can enable new composite paradigms for emerging technologies that demand mechanical compliance with multifunctional response.
Fabricating complex structures on micro‐ and mesoscales is a critical aspect in the design of advanced sensors and soft electronics. However, soft lithographic methods offer an important approach to fabricating such structures, the progress in the field of additive manufacturing (e.g., 3D printing) offers methods of fabrication with much more material complexity. The rheological complexity of the printing material, however, often dictates the limitations of printing. In particular, the challenges involved in synthesizing printing materials that can enable shape retention at smaller scales (<100 μm), yet be conductive, limits many applications of 3D printing to soft microelectronics. Herein, a printing‐centered approach using a novel particle‐free conductive emulsion ink is presented. This approach separates the printing and polymerization of a conductive monomer (pyrrole) and renders a novel ink that is used to print filaments with heretofore impossible to realize 3D feature dimensions and build structures with high shape retention. The printability of the ink is evaluated, and post‐treatment properties assessed. Multidirectional strain sensors are printed using the emulsion ink to illustrate an exemplary application in soft electronics.
- Award ID(s):
- 1463203
- NSF-PAR ID:
- 10288101
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Engineering Materials
- Volume:
- 24
- Issue:
- 3
- ISSN:
- 1438-1656
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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